If you made any changes in Pure these will be visible here soon.

Network

Michael A. Casbon

  • Cardiff University

External person

Abhishek Banerjee

  • ON Semiconductor Corporation

External person

Paul J. Tasker

  • Cardiff University

External person

E. Zanoni

  • University of Padua

External person

Peter Moens

  • ON Semiconductor
  • ON Semiconductor Corporation

External person

G. Meneghesso

  • University of Padua

External person

M. Meneghini

  • University of Padua

External person

Mark Gajda

  • NXP Semiconductors
  • Nexperia

External person

Colin J. Humphreys

  • University of Cambridge

External person

Jan Šonský

  • NXP Semiconductors

External person

P. Moens

  • ON Semiconductor Corporation

External person

D. J. Wallis

  • University of Cambridge

External person

Zaffar H. Zaidi

  • University of Sheffield

External person

Saurabh Pandey

  • NXP Semiconductors
  • Nexperia

External person

Benoit Bakeroot

  • Universiteit Gent

External person

Hassan Hirshy

  • Cardiff University
  • Compound Semiconductor Applications Catapult

External person

Ivor Guiney

  • University of Cambridge

External person

K. B. Lee

  • University of Sheffield

External person

M. Tack

  • ON Semiconductor Corporation

External person

David J. Wallis

  • University of Cambridge
  • Cardiff University

External person

P. A. Houston

  • University of Sheffield

External person

Jeroen Croon

  • Nexperia
  • NXP Semiconductors

External person

Sheng Jiang

  • University of Sheffield

External person

David Calton

  • Nexperia
  • NXP Semiconductors

External person

Kean Boon Lee

  • University of Sheffield

External person

Peter A. Houston

  • University of Sheffield

External person

Balaji Padmanabhan

  • ON Semiconductor Corporation

External person

Josephine Chang

  • Northrop Gruman Systems Corp.
  • Northrop Grumman Mission Systems

External person

Khaled Elgaid

  • Cardiff University

External person

Minhan Mi

  • State Key Discipline Laboratory of Wide Bandgap Semiconductor Technology, Xidian University

External person

Jonathan Lees

  • Cardiff University

External person

Arno Stockman

  • ON Semiconductor Corporation
  • Universiteit Gent

External person

P. J. Tasker

  • Cardiff University

External person

Marcus Caesar

  • ON Semiconductor

External person

Helmut Jung

  • United Monolithic Semiconductors GmbH

External person

Siyu Liu

  • School of Advanced Materials and Nanotechnology, Xidian University

External person

Yue Hao

  • State Key Discipline Laboratory of Wide Bandgap Semiconductor Technology, Xidian University

External person

Alaleh Tajalli

  • University of Padua

External person

Xu Li

  • University of Glasgow

External person

Hervé Blanck

  • United Monolithic Semiconductors GmbH

External person

Shigenobu Yamakoshi

  • Tamura Corporation

External person

J Benedikt

  • Cardiff University

External person

Akito kuramata

  • Tamura Corporation

External person

Masataka Higashiwaki

  • National Institute of Information and Communications Technology (NICT)

External person

Woochul Jeon

  • ON Semiconductor Corporation

External person

Jeroen Croon

  • NXP Semiconductors

External person

Abdalla Eblabla

  • Cardiff University

External person

Johan J.T.M. Donkers

  • NXP Semiconductors

External person

Trevor Martin

  • IQE (Europe) Ltd.

External person

Yingcong Zhang

  • School of Advanced Materials and Nanotechnology, Xidian University

External person

Iain Thayne

  • University of Glasgow

External person

Godefridus Hurkx

  • NXP Semiconductors

External person

Bin Hou

  • State Key Discipline Laboratory of Wide Bandgap Semiconductor Technology, Xidian University

External person

Matteo Meneghini

  • University of Padua

External person

Ken Nagamatsu

  • Northrop Gruman Systems Corp.
  • Northrop Grumman Mission Systems

External person

B. Lambert

  • United Monolithic Semiconductors

External person

Xiaohua Ma

  • State Key Discipline Laboratory of Wide Bandgap Semiconductor Technology, Xidian University

External person

Enrico Zanoni

  • University of Padua

External person

Edward Wasige

  • University of Glasgow

External person

Justine Parke

  • Northrop Gruman Systems Corp.

External person

Abdullah Al-Khalidi

  • University of Glasgow

External person

Kohei Sasaki

  • Tamura Corporation

External person

Joseph J. Freedsman

  • Nagoya Institute of Technology, Nagoya

External person

Yi Pei

  • University of California, Santa Barbara

External person

Ahmed Nejim

  • Silvaco Europe

External person

Johannes Benedikt

  • Cardiff University

External person

Brian Loran

  • Akash Systems

External person

Robert S. Howell

  • Northrop Grumman Mission Systems

External person

P Tasker

  • Cardiff University

External person

Tetsu Kachi

  • Nagoya University

External person

Takashi Egawa

  • Nagoya Institute of Technology, Nagoya

External person

Richard M. Perks

  • Cardiff University

External person

Ishan Wathuthanthri

  • Northrop Gruman Systems Corp.

External person

Gaudenzio Meneghesso

  • University of Padua

External person

S. Mouhoubi

  • ON Semiconductor Corporation

External person

Geoff Haynes

  • Inspirit Ventures, Ltd.

External person

Mengyuan Hua

  • Hong Kong University of Science and Technology

External person

Dan Kinzer

  • Navitas Semiconductor

External person

A. Paccagnella

  • University of Padua
  • Dip. Ingegneria dell'Informazione

External person

Ruiyang Yu

  • University of Texas at Austin

External person

Pengfei Wang

  • School of Advanced Materials and Nanotechnology, Xidian University
  • TNEI Services Ltd
  • Northumbria University

External person

Qingyun Huang

  • University of Texas at Austin

External person

Sarah J. Haigh

  • superSTEM
  • University of Manchester

External person

V. Unni

  • University of Sheffield

External person

Qing Zeng Zhu

  • University of Bremen
  • Lawrence Berkeley National Laboratory

External person

Raghunath Reddy

  • MicroLink Devices, Inc.

External person

Zhanbo Xia

  • Ohio State University

External person

T. Kachi

  • Nagoya University

External person

Jing Xie

  • Royal Victorian Eye and Ear Hospital
  • University of Melbourne
  • Qorvo Inc.

External person

Shahrzad Hosseini Vajargah

  • University of Cambridge

External person

Iain G. Thayne

  • University of Glasgow

External person

Andrew Allerman

  • Sandia National Laboratories, New Mexico

External person

A Salih

  • ON Semiconductor

External person

Carlo De Santi

  • University of Padua

External person

C. Thomas Foxon

  • University of Nottingham

External person

Sergei V. Novikov

  • University of Nottingham

External person

Armando Torres

  • University Grenoble Alpes

External person

M. Plissonnier

  • University Grenoble Alpes

External person

E. Beam

  • Qorvo Inc.

External person

Paul R. Chalker

  • University of Liverpool

External person

Y. Baines

  • University Grenoble Alpes

External person

Ling Yang

  • School of Advanced Materials and Nanotechnology, Xidian University

External person

S. Kolluri

  • University of California, Santa Barbara

External person

Maria Merlyne De Souza

  • University of Sheffield

External person

Daniel Piedra

  • Massachusetts Institute of Technology

External person

S. Yagi

  • Powdec KK

External person

Dilini Hemakumara

  • University of Glasgow

External person

Ashwani Kumar

  • University of Sheffield

External person

Matteo Borga

  • University of Padua

External person

Nicola Trivellin

  • University of Padua

External person

R Mccarthy

  • MicroLink Devices, Inc.

External person

Umesh Mishra

  • University of California, Santa Barbara

External person

M. Bagatin

  • University of Padua
  • Dip. Ingegneria dell'Informazione

External person

Shu Yang

  • Zhejiang University

External person

Tomás Palacios

  • Massachusetts Institute of Technology

External person

Ling Yang

  • University of Oxford

External person

T. Bouchet

  • University Grenoble Alpes

External person

H Amano

  • Nagoya University

External person

Andrew Armstrong

  • Sandia National Laboratories, New Mexico

External person

E. M.S. Narayanan

  • University of Sheffield

External person

Salat Salaru

  • Northrop Gruman Systems Corp.

External person

E. Morvan

  • University Grenoble Alpes

External person

Yuhao Zhang

  • Massachusetts Institute of Technology

External person

C. Youtsey

  • MicroLink Devices, Inc.

External person

Jim Carroll

  • Akash Systems

External person

Man Hoi Wong

  • Natl Inst Informat & Commun Technol NICT, National Institution of Information & Communication Technology (NICT) - Japan
  • National Institute of Information and Communications Technology (NICT)

External person

Oliver Häberlen

  • Infineon Technologies Austria AG

External person

S. Gerardin

  • University of Padua
  • Dip. Ingegneria dell'Informazione

External person

Matthew D Smith

  • University of Glasgow

External person

Stephen Oliver

  • Navitas Semiconductor

External person

Alex Huang

  • University of Texas at Austin

External person

Nadim Chowdhury

  • Massachusetts Institute of Technology

External person

Herve Blanck

  • United Monolithic Semiconductors GmbH

External person

A. Nakajima

  • National Institute of Advanced Industrial Science and Technology

External person

H Kawai

  • Powdec KK

External person

Larry Witkowski

  • Akash Systems

External person

M Charles

  • Sorbonne University
  • University Grenoble Alpes

External person

Rongming Chu

  • HRL Laboratories

External person

Yuewei Zhang

  • Ohio State University

External person

Marty Yarborough

  • Akash Systems

External person

C Liu

  • ON Semiconductor

External person

Jie Hu

  • Massachusetts Institute of Technology

External person

Helmut Jung

  • United Monolithic Semiconductors GmbH

External person

U. K. Mishra

  • University of California, Santa Barbara

External person

Min Sun

  • Massachusetts Institute of Technology

External person

R. Perks

  • Cardiff University

External person

H Choi

  • Cardiff University

External person

Robert Kaplar

  • Sandia National Laboratories, New Mexico

External person

L. Di Cioccio

  • University Grenoble Alpes

External person

L. Guido

  • Virginia Polytechnic Institute and State University

External person

Siddharth Rajan

  • Ohio State University

External person

Justin A. Parke

  • Northrop Grumman Mission Systems

External person