Abstract
As GaN power transistor technology matures it is increasingly important to understand any links between substrate “quality”, epi-layer growth and electrical characteristics of the 2-dimensional electron gas (2DEG), which forms the active part of devices. We present a study, which makes use of full wafer mapping techniques to examine these relationships. Substrate off-cut is shown to be an important parameter in controlling the uniformity of GaN HFET device layers on SiC substrates.
Original language | English |
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Pages (from-to) | 125-128 |
Number of pages | 4 |
Journal | Journal of Crystal Growth |
Volume | 338 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2012 |