2D/3D AudioVisual content analysis & description

Ioannis Pitas; K. Papachristou; N. Nikolaidis; M. Liuni; L. Benaroya; G. Peeters; A. Roebel; A. Linnemann; M. Liu; S. Gerke

doi:10.1109/MMSP.2014.6958837

2D/3D AudioVisual content analysis & description

Ioannis Pitas, K. Papachristou, N. Nikolaidis, M. Liuni, L. Benaroya, G. Peeters, A. Roebel, A. Linnemann, M. Liu, S. Gerke

Department of Electrical & Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

200 Downloads (Pure)

Abstract

In this paper, we propose a way of using the Audio-Visual Description Profile (AVDP) of the MPEG-7 standard for 2D or stereo video and multichannel audio content description. Our aim is to provide means of using AVDP in such a way, that 3D video and audio content can be correctly and consistently described. Since AVDP semantics do not include ways for dealing with 3D audiovisual content, a new semantic framework within AVDP is proposed and examples of using AVDP to describe the results of analysis algorithms on stereo video and multichannel audio content are presented.

Original language	English
Title of host publication	2014 IEEE 16th International Workshop on Multimedia Signal Processing (MMSP 2014)
Subtitle of host publication	Proceedings of a meeting held 22-24 September 2014, Jakarta, Indonesia
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	1-6
Number of pages	6
ISBN (Electronic)	9781479958962
ISBN (Print)	9781479958979
DOIs	https://doi.org/10.1109/MMSP.2014.6958837
Publication status	Published - Jan 2015
Event	IEEE 16th International Workshop on Multimedia Signal Processing (MMSP2014 - Jakarta, Indonesia Duration: 22 Sep 2014 → 24 Sep 2014

Conference

Conference	IEEE 16th International Workshop on Multimedia Signal Processing (MMSP2014
Country	Indonesia
City	Jakarta
Period	22/09/14 → 24/09/14

Keywords

AudioVisual Description Profile (AVDP)
MPEG-7
stereo video
semantic content description

Access to Document

10.1109/MMSP.2014.6958837

Full-text PDF (accepted author manuscript)
This is the author accepted manuscript (AAM). The final published version (version of record) is available online via IEEE at http://ieeexplore.ieee.org/document/6958837/. Please refer to any applicable terms of use of the publisher.
Accepted author manuscript, 180 KB

Fingerprint Dive into the research topics of '2D/3D AudioVisual content analysis & description'. Together they form a unique fingerprint.

Cite this

Pitas, I., Papachristou, K., Nikolaidis, N., Liuni, M., Benaroya, L., Peeters, G., Roebel, A., Linnemann, A., Liu, M., & Gerke, S. (2015). 2D/3D AudioVisual content analysis & description. In 2014 IEEE 16th International Workshop on Multimedia Signal Processing (MMSP 2014): Proceedings of a meeting held 22-24 September 2014, Jakarta, Indonesia (pp. 1-6). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/MMSP.2014.6958837

Pitas, Ioannis ; Papachristou, K. ; Nikolaidis, N. ; Liuni, M. ; Benaroya, L. ; Peeters, G. ; Roebel, A. ; Linnemann, A. ; Liu, M. ; Gerke, S. / 2D/3D AudioVisual content analysis & description. 2014 IEEE 16th International Workshop on Multimedia Signal Processing (MMSP 2014): Proceedings of a meeting held 22-24 September 2014, Jakarta, Indonesia. Institute of Electrical and Electronics Engineers (IEEE), 2015. pp. 1-6

@inproceedings{f024ced52cd1465a886da02f7829515d,

title = "2D/3D AudioVisual content analysis & description",

abstract = "In this paper, we propose a way of using the Audio-Visual Description Profile (AVDP) of the MPEG-7 standard for 2D or stereo video and multichannel audio content description. Our aim is to provide means of using AVDP in such a way, that 3D video and audio content can be correctly and consistently described. Since AVDP semantics do not include ways for dealing with 3D audiovisual content, a new semantic framework within AVDP is proposed and examples of using AVDP to describe the results of analysis algorithms on stereo video and multichannel audio content are presented.",

keywords = "AudioVisual Description Profile (AVDP), MPEG-7, stereo video, semantic content description",

author = "Ioannis Pitas and K. Papachristou and N. Nikolaidis and M. Liuni and L. Benaroya and G. Peeters and A. Roebel and A. Linnemann and M. Liu and S. Gerke",

year = "2015",

month = jan,

doi = "10.1109/MMSP.2014.6958837",

language = "English",

isbn = "9781479958979",

pages = "1--6",

booktitle = "2014 IEEE 16th International Workshop on Multimedia Signal Processing (MMSP 2014)",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "IEEE 16th International Workshop on Multimedia Signal Processing (MMSP2014 ; Conference date: 22-09-2014 Through 24-09-2014",

}

Pitas, I, Papachristou, K, Nikolaidis, N, Liuni, M, Benaroya, L, Peeters, G, Roebel, A, Linnemann, A, Liu, M & Gerke, S 2015, 2D/3D AudioVisual content analysis & description. in 2014 IEEE 16th International Workshop on Multimedia Signal Processing (MMSP 2014): Proceedings of a meeting held 22-24 September 2014, Jakarta, Indonesia. Institute of Electrical and Electronics Engineers (IEEE), pp. 1-6, IEEE 16th International Workshop on Multimedia Signal Processing (MMSP2014, Jakarta, Indonesia, 22/09/14. https://doi.org/10.1109/MMSP.2014.6958837

2D/3D AudioVisual content analysis & description. / Pitas, Ioannis; Papachristou, K.; Nikolaidis, N.; Liuni, M.; Benaroya, L.; Peeters, G.; Roebel, A.; Linnemann, A.; Liu, M.; Gerke, S.

2014 IEEE 16th International Workshop on Multimedia Signal Processing (MMSP 2014): Proceedings of a meeting held 22-24 September 2014, Jakarta, Indonesia. Institute of Electrical and Electronics Engineers (IEEE), 2015. p. 1-6.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - 2D/3D AudioVisual content analysis & description

AU - Pitas, Ioannis

AU - Papachristou, K.

AU - Nikolaidis, N.

AU - Liuni, M.

AU - Benaroya, L.

AU - Peeters, G.

AU - Roebel, A.

AU - Linnemann, A.

AU - Liu, M.

AU - Gerke, S.

PY - 2015/1

Y1 - 2015/1

N2 - In this paper, we propose a way of using the Audio-Visual Description Profile (AVDP) of the MPEG-7 standard for 2D or stereo video and multichannel audio content description. Our aim is to provide means of using AVDP in such a way, that 3D video and audio content can be correctly and consistently described. Since AVDP semantics do not include ways for dealing with 3D audiovisual content, a new semantic framework within AVDP is proposed and examples of using AVDP to describe the results of analysis algorithms on stereo video and multichannel audio content are presented.

AB - In this paper, we propose a way of using the Audio-Visual Description Profile (AVDP) of the MPEG-7 standard for 2D or stereo video and multichannel audio content description. Our aim is to provide means of using AVDP in such a way, that 3D video and audio content can be correctly and consistently described. Since AVDP semantics do not include ways for dealing with 3D audiovisual content, a new semantic framework within AVDP is proposed and examples of using AVDP to describe the results of analysis algorithms on stereo video and multichannel audio content are presented.

KW - AudioVisual Description Profile (AVDP)

KW - MPEG-7

KW - stereo video

KW - semantic content description

U2 - 10.1109/MMSP.2014.6958837

DO - 10.1109/MMSP.2014.6958837

M3 - Conference Contribution (Conference Proceeding)

SN - 9781479958979

SP - 1

EP - 6

BT - 2014 IEEE 16th International Workshop on Multimedia Signal Processing (MMSP 2014)

PB - Institute of Electrical and Electronics Engineers (IEEE)

T2 - IEEE 16th International Workshop on Multimedia Signal Processing (MMSP2014

Y2 - 22 September 2014 through 24 September 2014

ER -

Pitas I, Papachristou K, Nikolaidis N, Liuni M, Benaroya L, Peeters G et al. 2D/3D AudioVisual content analysis & description. In 2014 IEEE 16th International Workshop on Multimedia Signal Processing (MMSP 2014): Proceedings of a meeting held 22-24 September 2014, Jakarta, Indonesia. Institute of Electrical and Electronics Engineers (IEEE). 2015. p. 1-6 https://doi.org/10.1109/MMSP.2014.6958837