A high throughput 3D-bus interconnect for network processors

T Kocak, J Engel

Research output: Contribution to journalArticle (Academic Journal)peer-review

Translated title of the contributionA high throughput 3D-bus interconnect for network processors
Original languageEnglish
Pages (from-to)15 - 25
Number of pages11
JournalMicroprocessors and Microsystems
Volume30 (1)
DOIs
Publication statusPublished - Feb 2006

Bibliographical note

Publisher: Elsevier

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