A high throughput 3D-bus interconnect for network processors

T Kocak, J Engel

Research output: Contribution to journal › Article (Academic Journal) › peer-review

Translated title of the contribution	A high throughput 3D-bus interconnect for network processors
Original language	English
Pages (from-to)	15 - 25
Number of pages	11
Journal	Microprocessors and Microsystems
Volume	30 (1)
DOIs	https://doi.org/10.1016/j.micpro.2005.04.002
Publication status	Published - Feb 2006

Publisher: Elsevier

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title = "A high throughput 3D-bus interconnect for network processors",

author = "T Kocak and J Engel",

note = "Publisher: Elsevier",

year = "2006",

month = feb,

doi = "10.1016/j.micpro.2005.04.002",

language = "English",

volume = "30 (1)",

pages = "15 -- 25",

journal = "Microprocessors and Microsystems",

issn = "0141-9331",

publisher = "Elsevier",

}

TY - JOUR

T1 - A high throughput 3D-bus interconnect for network processors

AU - Kocak, T

AU - Engel, J

N1 - Publisher: Elsevier

PY - 2006/2

Y1 - 2006/2

U2 - 10.1016/j.micpro.2005.04.002

DO - 10.1016/j.micpro.2005.04.002

M3 - Article (Academic Journal)

VL - 30 (1)

SP - 15

EP - 25

JO - Microprocessors and Microsystems

JF - Microprocessors and Microsystems

SN - 0141-9331

ER -