Translated title of the contribution | A high throughput 3D-bus interconnect for network processors |
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Original language | English |
Pages (from-to) | 15 - 25 |
Number of pages | 11 |
Journal | Microprocessors and Microsystems |
Volume | 30 (1) |
DOIs | |
Publication status | Published - Feb 2006 |
A high throughput 3D-bus interconnect for network processors
T Kocak, J Engel
Research output: Contribution to journal › Article (Academic Journal) › peer-review