Abstract
We review the Raman thermography technique, which has been developed to determine the temperature in and around the active area of semiconductor devices with submicron spatial and nanosecond temporal resolution. This is critical for the qualification of device technology, including for accelerated lifetime reliability testing and device design optimization. Its practical use is illustrated for GaN and GaAs-based high electron mobility transistors and opto-electronic devices. We also discuss how Raman thermography is used to validate device thermal models, as well as determining the thermal conductivity of materials relevant for electronic and opto-electronic devices.
Original language | English |
---|---|
Pages (from-to) | 667-684 |
Number of pages | 18 |
Journal | IEEE Transactions on Device and Materials Reliability |
Volume | 16 |
Issue number | 4 |
Early online date | 13 Oct 2016 |
DOIs | |
Publication status | Published - 2 Dec 2016 |
Research Groups and Themes
- CDTR
Keywords
- HEMTs
- Optoelectronic devices
- Semiconductor device measurement
- Spatial resolution
- Temperature
- Temperature measurement
- Wavelength measurement
- GaAs
- GaN
- HEMT
- Thermography
- reliability
- thermal management
- thermal simulation