Abstract
This paper describes a powerful simulation platform that enables accurate simulations of numerous network configurations under realistic traffic patterns to predict the performance and power needs of a 3-D integrated system early in the design flow. The simulation platform can model virtually any sized 2-D or 3-D network configuration, providing low-cost and fast tradeoff evaluations of various systems architectures. The network simulator uses scalable RTL-level models that can be used for accurate power and timing analyses. We demonstrate the capability of our simulation model by analyzing the performance of various network topologies under spatio-temporal traffic patterns to show how the network topology can be adjusted to meet the performance requirements of a design before it is manufactured. The simulation results can be used to optimize the placement of cores and communication buses early in the flow. By using the model, standard applications such as mobile application processor, femto-cell base-stations on-chip and wide-IO TSV memory stacking can be simulated.
| Original language | Undefined/Unknown |
|---|---|
| Title of host publication | Proc. IEEE International 3D Systems Integration Conference (3DIC) |
| Pages | 1-5 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 1 Oct 2013 |
Research Groups and Themes
- Photonics and Quantum
Keywords
- integrated circuit design
- integrated circuit modelling
- network topology
- network-on-chip
- three-dimensional integrated circuits
- 2D network configuration
- 3D integrated system
- 3D network configuration
- communication buses
- core placement
- diverse spatio-temporal traffic patterns
- femto-cell base-stations on-chip
- mobile application processor
- multidimensional NoC simulation model
- wide-IO TSV memory stacking
- Analytical models
- Data mining
- Integrated circuit modeling
- Monitoring
- Solid modeling
- System-on-chip
- Through-silicon vias
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