A study of thermal conductivity of boron-nitride epoxy-matrix composites

K. Gaska, A. Rybak, Cz Kapusta, R. Sekula, A. Siwek

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

2 Citations (Scopus)

Abstract

The aim of the work is assessment of the possibility of increasing the thermal conductivity of the filled epoxy resins. The heat management in the electronic and power devices is a crucial issue. It is an important problem to be solved in order to prevent such devices from malfunction. The effective heat dissipation is thus one of the main challenging problems to be solved. The pure boron nitride micro-powders with different size distribution and surface modification, as well boron nitride mixtures with silica were used as the fillers for preparation of the epoxy resin composites. A representative set of filled epoxy samples has been prepared with the different content of the investigated fillers. The thermal conductivity measurements have been performed on these samples at the room temperature and SEM observations have been showed.

Original languageEnglish
Title of host publicationECCM 2012 - Composites at Venice, Proceedings of the 15th European Conference on Composite Materials
PublisherEuropean Conference on Composite Materials, ECCM
ISBN (Print)9788888785332
Publication statusPublished - 1 Jan 2012
Event15th European Conference on Composite Materials: Composites at Venice, ECCM 2012 - Venice, United Kingdom
Duration: 24 Jun 201228 Jun 2012

Publication series

NameECCM 2012 - Composites at Venice, Proceedings of the 15th European Conference on Composite Materials

Conference

Conference15th European Conference on Composite Materials: Composites at Venice, ECCM 2012
CountryUnited Kingdom
CityVenice
Period24/06/1228/06/12

Keywords

  • Boron nitride
  • Epoxy composites
  • Thermal conductivity

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