TY - GEN
T1 - A theoretical model of a new electrostatic transducer incorporating fluidic amplification
AU - Walker, Alan J.
AU - Mulholland, Anthony
AU - Campbell, Ewan Fraser
AU - Hayward, G.
PY - 2008
Y1 - 2008
N2 - This article concerns the design of a new electrostatic
transducer whose backplate consists of a series of
drilled pipes. A new one-dimensional model is derived which
considers the interaction of the membrane with the air load,
the air cavities, and the drilled pipes in the backplate. Dynamic equations for the impedance in each component of the device are calculated analytically and connected using interface conditions of continuity of pressure and radiation conditions into the air load. The model is able to produce solutions to the mechanical impedance of the device and the displacement of the membrane as a function of the device's design parameters. Model results for the output pressure compare well with previous experimental
data. The inverse problem of retrieving the design parameters for a desired output is discussed.
AB - This article concerns the design of a new electrostatic
transducer whose backplate consists of a series of
drilled pipes. A new one-dimensional model is derived which
considers the interaction of the membrane with the air load,
the air cavities, and the drilled pipes in the backplate. Dynamic equations for the impedance in each component of the device are calculated analytically and connected using interface conditions of continuity of pressure and radiation conditions into the air load. The model is able to produce solutions to the mechanical impedance of the device and the displacement of the membrane as a function of the device's design parameters. Model results for the output pressure compare well with previous experimental
data. The inverse problem of retrieving the design parameters for a desired output is discussed.
UR - https://pureportal-staging.strath.ac.uk/en/publications/770b7e6e-c4fe-40e5-81d0-061911459d92
M3 - Conference Contribution (Conference Proceeding)
BT - 2008 IEEE International Ultrasonics Symposium, Beijing, China, 1/01/00
ER -