Abstract
A multilevel dynamic interconnect model was derived for accurate a priori signal integrity estimates. Cross-talk and delay estimations over interconnects in deep submicron technology were analyzed systematically using this model. Good accuracy and excellent time-efficiency were found compared with electromagnetic simulations. We aim to build a dynamic interconnect library with this model to facilitate the interconnect issues for future VLSI design.
Original language | Undefined/Unknown |
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Title of host publication | Proc. European Solid-State Circuits Conference |
Publication status | Published - 1 Sep 2000 |
Keywords
- Circuit noise
- Crosstalk
- Electrical capacitance tomography
- Integrated circuit interconnections
- Routing
- Signal analysis
- Signal design
- Timing
- Very large scale integration
- Wiring