Accurate surface-to-bulk feature alignment and feature size preservation during double-sided wafer processing using C4F8 plasma polymer for the fabrication of electrostatically actuated cantilever devices

Sunil Rana*, Ivano Gregoratto, Pedro M. Ortiz, Alun James Harris, James S. Burdess, Calum J. McNeil

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)peer-review

Abstract

An accurate alignment of surface-to-bulk features (within ±;2μm) during a double-sided silicon wafer processing can be extremely difficult. This is due to a combination of mask misalignment errors and unreliability of bulk etching techniques in translating the bulk feature shapes down to the surface side. In this paper, we present a fabrication process for an electrostatically actuated cantilever device where an accurate surface-to-bulk feature alignment is imperative to the operation of the device. The fabrication process compensates for the bulk etch-induced feature size variation and mask misalignment errors using a combination of self-aligning features and C 4F8 plasma polymer passivation.

Original languageEnglish
Article number5484548
Pages (from-to)871-877
Number of pages7
JournalJournal of Microelectromechanical Systems
Volume19
Issue number4
DOIs
Publication statusPublished - Aug 2010

Keywords

  • Atomic force microscopy
  • cantilever
  • deep reactive ion etching (DRIE)
  • passivation

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