Adhesive bonding in microelectronics and photonics

BG Yacobi, S Martin, K Davis, AJ Hudson, M Hubert

Research output: Contribution to journal › Article (Academic Journal)

85 Citations (Scopus)

Translated title of the contribution	Adhesive bonding in microelectronics and photonics
Original language	English
Pages (from-to)	6227 - 6262
Number of pages	36
Journal	Journal of Applied Physics
Volume	91 (10)
DOIs	https://doi.org/10.1063/1.1467950
Publication status	Published - May 2002

Publisher: American Institute of Physics

Access to Document

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title = "Adhesive bonding in microelectronics and photonics",

author = "BG Yacobi and S Martin and K Davis and AJ Hudson and M Hubert",

note = "Publisher: American Institute of Physics",

year = "2002",

month = may,

doi = "10.1063/1.1467950",

language = "English",

volume = "91 (10)",

pages = "6227 -- 6262",

journal = "Journal of Applied Physics",

issn = "0021-8979",

publisher = "American Institute of Physics (AIP)",

}

TY - JOUR

T1 - Adhesive bonding in microelectronics and photonics

AU - Yacobi, BG

AU - Martin, S

AU - Davis, K

AU - Hudson, AJ

AU - Hubert, M

N1 - Publisher: American Institute of Physics

PY - 2002/5

Y1 - 2002/5

U2 - 10.1063/1.1467950

DO - 10.1063/1.1467950

M3 - Article (Academic Journal)

VL - 91 (10)

SP - 6227

EP - 6262

JO - Journal of Applied Physics

JF - Journal of Applied Physics

SN - 0021-8979

ER -