Advanced cooling solutions of high power automotive module

Power semiconductor modules play an important role in automotive power-train systems. The auto motive module has a higher power density compa red with the traditional power semiconductor mod ules. So in order to improve module reliability and life expectancy, when module package design th at thermal management need to focus on. This pa per introduces an advanced cooling solution, inclu ding module package structure and assembly pro cesses, to improve the module thermal performan ce include thermal resistance and thermal uniform ity, which further increases the power density of t he automotive power-train systems. The paper pr esents a new power semiconductor module base plate which structure is Vapour Chambers (VP) pr ovide far superior thermal performance than tradit ional copper baseplate at reduced weight and hei ght. In the paper, designed package trail based o n VP been applied, the simulation and experiment al results are compared to prove that the solution is feasible.