Abstract
This work proposes a simple analytical model for interface bonding in 5G WLANs at the 2.4 GHz and 60 GHz ISM bands. Based on previous analysis of the IEEE 802.11 DCF by Bianchi and Chatzimisios, an expression for the predicted throughput of the bonded interface is given as a function of the number of competing wireless nodes in each network. The model is implemented and validated in MatLab using the Monte Carlo method. When applied to a practical interface bonding scenario, the model results suggest a practical limit of fifteen 2.4 GHz nodes when bonded with a 60 GHz interface, above which the resulting compound throughput is less than that of a single 60 GHz interface.
| Original language | English |
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| Title of host publication | 2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD 2018) |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Number of pages | 5 |
| ISBN (Electronic) | 9781538661512 |
| ISBN (Print) | 9781538661529 |
| DOIs | |
| Publication status | E-pub ahead of print - 1 Nov 2018 |
| Event | 2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks - Barcelona, Spain Duration: 17 Sep 2018 → 19 Sep 2018 http://camad2018.ieee-camad.org/ |
Publication series
| Name | |
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| ISSN (Print) | 2378-4865 |
| ISSN (Electronic) | 2378-4873 |
Conference
| Conference | 2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks |
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| Abbreviated title | CAMAD 2018 |
| Country/Territory | Spain |
| City | Barcelona |
| Period | 17/09/18 → 19/09/18 |
| Internet address |