Analysing Interface Bonding in 5G WLANs

Michael Dilmore; Angela Doufexi; George Oikonomou

doi:10.1109/CAMAD.2018.8514934

Analysing Interface Bonding in 5G WLANs

Michael Dilmore, Angela Doufexi, George Oikonomou

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

1 Citation (Scopus)

200 Downloads (Pure)

Abstract

This work proposes a simple analytical model for interface bonding in 5G WLANs at the 2.4 GHz and 60 GHz ISM bands. Based on previous analysis of the IEEE 802.11 DCF by Bianchi and Chatzimisios, an expression for the predicted throughput of the bonded interface is given as a function of the number of competing wireless nodes in each network. The model is implemented and validated in MatLab using the Monte Carlo method. When applied to a practical interface bonding scenario, the model results suggest a practical limit of fifteen 2.4 GHz nodes when bonded with a 60 GHz interface, above which the resulting compound throughput is less than that of a single 60 GHz interface.

Original language	English
Title of host publication	2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD 2018)
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Number of pages	5
ISBN (Electronic)	9781538661512
ISBN (Print)	9781538661529
DOIs	https://doi.org/10.1109/CAMAD.2018.8514934
Publication status	E-pub ahead of print - 1 Nov 2018
Event	2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks - Barcelona, Spain Duration: 17 Sep 2018 → 19 Sep 2018 http://camad2018.ieee-camad.org/

Publication series

Name
ISSN (Print)	2378-4865
ISSN (Electronic)	2378-4873

Conference

Conference	2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks
Abbreviated title	CAMAD 2018
Country	Spain
City	Barcelona
Period	17/09/18 → 19/09/18
Internet address	http://camad2018.ieee-camad.org/

Access to Document

10.1109/CAMAD.2018.8514934

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Cite this

@inproceedings{45cb641ed79b4304bbb7ebc9f07ca667,

title = "Analysing Interface Bonding in 5G WLANs",

abstract = "This work proposes a simple analytical model for interface bonding in 5G WLANs at the 2.4 GHz and 60 GHz ISM bands. Based on previous analysis of the IEEE 802.11 DCF by Bianchi and Chatzimisios, an expression for the predicted throughput of the bonded interface is given as a function of the number of competing wireless nodes in each network. The model is implemented and validated in MatLab using the Monte Carlo method. When applied to a practical interface bonding scenario, the model results suggest a practical limit of fifteen 2.4 GHz nodes when bonded with a 60 GHz interface, above which the resulting compound throughput is less than that of a single 60 GHz interface.",

author = "Michael Dilmore and Angela Doufexi and George Oikonomou",

year = "2018",

month = nov,

day = "1",

doi = "10.1109/CAMAD.2018.8514934",

language = "English",

isbn = "9781538661529",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

booktitle = "2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD 2018)",

address = "United States",

note = "2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks , CAMAD 2018 ; Conference date: 17-09-2018 Through 19-09-2018",

url = "http://camad2018.ieee-camad.org/",

}

Dilmore, M , Doufexi, A & Oikonomou, G 2018, Analysing Interface Bonding in 5G WLANs. in 2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD 2018). Institute of Electrical and Electronics Engineers (IEEE), 2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks , Barcelona, Spain, 17/09/18. https://doi.org/10.1109/CAMAD.2018.8514934

Analysing Interface Bonding in 5G WLANs. / Dilmore, Michael ; Doufexi, Angela ; Oikonomou, George.

2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD 2018). Institute of Electrical and Electronics Engineers (IEEE), 2018.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - Analysing Interface Bonding in 5G WLANs

AU - Dilmore, Michael

AU - Doufexi, Angela

AU - Oikonomou, George

PY - 2018/11/1

Y1 - 2018/11/1

N2 - This work proposes a simple analytical model for interface bonding in 5G WLANs at the 2.4 GHz and 60 GHz ISM bands. Based on previous analysis of the IEEE 802.11 DCF by Bianchi and Chatzimisios, an expression for the predicted throughput of the bonded interface is given as a function of the number of competing wireless nodes in each network. The model is implemented and validated in MatLab using the Monte Carlo method. When applied to a practical interface bonding scenario, the model results suggest a practical limit of fifteen 2.4 GHz nodes when bonded with a 60 GHz interface, above which the resulting compound throughput is less than that of a single 60 GHz interface.

AB - This work proposes a simple analytical model for interface bonding in 5G WLANs at the 2.4 GHz and 60 GHz ISM bands. Based on previous analysis of the IEEE 802.11 DCF by Bianchi and Chatzimisios, an expression for the predicted throughput of the bonded interface is given as a function of the number of competing wireless nodes in each network. The model is implemented and validated in MatLab using the Monte Carlo method. When applied to a practical interface bonding scenario, the model results suggest a practical limit of fifteen 2.4 GHz nodes when bonded with a 60 GHz interface, above which the resulting compound throughput is less than that of a single 60 GHz interface.

U2 - 10.1109/CAMAD.2018.8514934

DO - 10.1109/CAMAD.2018.8514934

M3 - Conference Contribution (Conference Proceeding)

SN - 9781538661529

BT - 2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD 2018)

PB - Institute of Electrical and Electronics Engineers (IEEE)

T2 - 2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks

Y2 - 17 September 2018 through 19 September 2018

ER -