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Abstract

This work proposes a simple analytical model for interface bonding in 5G WLANs at the 2.4 GHz and 60 GHz ISM bands. Based on previous analysis of the IEEE 802.11 DCF by Bianchi and Chatzimisios, an expression for the predicted throughput of the bonded interface is given as a function of the number of competing wireless nodes in each network. The model is implemented and validated in MatLab using the Monte Carlo method. When applied to a practical interface bonding scenario, the model results suggest a practical limit of fifteen 2.4 GHz nodes when bonded with a 60 GHz interface, above which the resulting compound throughput is less than that of a single 60 GHz interface.
Original languageEnglish
Title of host publication2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD 2018)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages5
ISBN (Electronic)9781538661512
ISBN (Print)9781538661529
DOIs
Publication statusE-pub ahead of print - 1 Nov 2018
Event2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks - Barcelona, Spain
Duration: 17 Sep 201819 Sep 2018
http://camad2018.ieee-camad.org/

Publication series

Name
ISSN (Print)2378-4865
ISSN (Electronic)2378-4873

Conference

Conference2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks
Abbreviated titleCAMAD 2018
CountrySpain
CityBarcelona
Period17/09/1819/09/18
Internet address

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  • Cite this

    Dilmore, M., Doufexi, A., & Oikonomou, G. (2018). Analysing Interface Bonding in 5G WLANs. In 2018 IEEE 23rd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD 2018) Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/CAMAD.2018.8514934