Analysis of grain-boundary structure in Al-Cu interconnects

DP Field, JE Sanchez, PR Besser, DJ Dingley

Research output: Contribution to journalArticle (Academic Journal)peer-review

32 Citations (Scopus)
Translated title of the contributionAnalysis of grain-boundary structure in Al-Cu interconnects
Original languageEnglish
Pages (from-to)2383 - 2392
JournalJournal of Applied Physics
Volume82
Publication statusPublished - 1997

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