Translated title of the contribution | Analysis of grain-boundary structure in Al-Cu interconnects |
---|---|
Original language | English |
Pages (from-to) | 2383 - 2392 |
Journal | Journal of Applied Physics |
Volume | 82 |
Publication status | Published - 1997 |
Analysis of grain-boundary structure in Al-Cu interconnects
DP Field, JE Sanchez, PR Besser, DJ Dingley
Research output: Contribution to journal › Article (Academic Journal) › peer-review
32
Citations
(Scopus)