Analysis of grain-boundary structure in Al-Cu interconnects

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Translated title of the contribution	Analysis of grain-boundary structure in Al-Cu interconnects
Original language	English
Pages (from-to)	2383 - 2392
Journal	Journal of Applied Physics
Volume	82
Publication status	Published - 1997

Handle.net

@article{9f6952d2d76544d586b0df82dc2a5c1c,

title = "Analysis of grain-boundary structure in Al-Cu interconnects",

author = "DP Field and JE Sanchez and PR Besser and DJ Dingley",

year = "1997",

language = "English",

volume = "82",

pages = "2383 -- 2392",

journal = "Journal of Applied Physics",

issn = "1089-7550",

publisher = "American Institute of Physics (AIP)",

}