Analysis of signal and power/ground pin assignment in multi-layer PCB and its impact on signal integrity and crosstalk

Ka Fai Chang; Joseph Romen Cubillo; Roshan Weerasekera; Cheng Jin; Boyu Zheng; Suryanarayana Shivakumar Bhattacharya

doi:10.1109/EPTC.2013.6745829

Analysis of signal and power/ground pin assignment in multi-layer PCB and its impact on signal integrity and crosstalk

Ka Fai Chang
, Joseph Romen Cubillo
, Roshan Weerasekera
, Cheng Jin
, Boyu Zheng
, Suryanarayana Shivakumar Bhattacharya

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

Original language	Undefined/Unknown
Title of host publication	2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)
Pages	789-792
Number of pages	4
DOIs	https://doi.org/10.1109/EPTC.2013.6745829
Publication status	Published - 2013

Research Groups and Themes

Photonics and Quantum

Access to Document

10.1109/EPTC.2013.6745829

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Persistent link

Cite this

@inproceedings{da945e45ad5e47dd99f21be514a7d223,

title = "Analysis of signal and power/ground pin assignment in multi-layer PCB and its impact on signal integrity and crosstalk",

author = "Chang, \{Ka Fai\} and Cubillo, \{Joseph Romen\} and Roshan Weerasekera and Cheng Jin and Boyu Zheng and Bhattacharya, \{Suryanarayana Shivakumar\}",

year = "2013",

doi = "10.1109/EPTC.2013.6745829",

language = "Undefined/Unknown",

pages = "789--792",

booktitle = "2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)",

}

Analysis of signal and power/ground pin assignment in multi-layer PCB and its impact on signal integrity and crosstalk. / Chang, Ka Fai; Cubillo, Joseph Romen; Weerasekera, Roshan et al.
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). 2013. p. 789-792.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - Analysis of signal and power/ground pin assignment in multi-layer PCB and its impact on signal integrity and crosstalk

AU - Chang, Ka Fai

AU - Cubillo, Joseph Romen

AU - Weerasekera, Roshan

AU - Jin, Cheng

AU - Zheng, Boyu

AU - Bhattacharya, Suryanarayana Shivakumar

PY - 2013

Y1 - 2013

U2 - 10.1109/EPTC.2013.6745829

DO - 10.1109/EPTC.2013.6745829

M3 - Conference Contribution (Conference Proceeding)

SP - 789

EP - 792

BT - 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

ER -