Analysis of signal integrity(SI) robustness in through-silicon interposer (TSI) interconnects

Roshan Weerasekera, Joseph Romen Cubillo, Guruprasad Katti

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

4 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)
Pages	397-398
Number of pages	2
DOIs	https://doi.org/10.1109/EPTC.2012.6507115
Publication status	Published - 2012

Research Groups and Themes

@inproceedings{8827e18b321346c39fea171231181ca3,

title = "Analysis of signal integrity(SI) robustness in through-silicon interposer (TSI) interconnects",

author = "Roshan Weerasekera and Cubillo, \{Joseph Romen\} and Guruprasad Katti",

year = "2012",

doi = "10.1109/EPTC.2012.6507115",

language = "Undefined/Unknown",

pages = "397--398",

booktitle = "2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)",

}

TY - GEN

T1 - Analysis of signal integrity(SI) robustness in through-silicon interposer (TSI) interconnects

AU - Weerasekera, Roshan

AU - Cubillo, Joseph Romen

AU - Katti, Guruprasad

PY - 2012

Y1 - 2012

U2 - 10.1109/EPTC.2012.6507115

DO - 10.1109/EPTC.2012.6507115

M3 - Conference Contribution (Conference Proceeding)

SP - 397

EP - 398

BT - 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)

ER -