Analysis of the 1st and 3rd Quadrant Transients of Symmetrical and Asymmetrical Double-Trench SiC Power MOSFETs

Juefei Yang*, Saeed Jahdi, Bernard Stark, Olayiwola Alatise, Jose Angel Ortiz Gonzalez, Phil Mellor

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)peer-review

11 Citations (Scopus)
350 Downloads (Pure)

Abstract

In this paper, performance at 1st and 3rd quadrant operation of Silicon and Silicon Carbide (SiC) symmetrical and asymmetrical double-trench, superjunction and planar power MOSFETs is analysed through a wide range of experimental measurements using compact modeling. The devices are evaluated on a high voltage clamped inductive switching test rig and switched at a range of switching rates at elevated junction temperatures. It is shown, experimentally, that in the 1st quadrant, CoolSiC (SiC asymmetrical double-trench) MOSFET and SiC symmetrical double-trench MOSFET demonstrate more stable temperature
coefficients. Silicon Superjunction MOSFETs exhibits the lowest turn-off switching rates due to the large input capacitance. The evaluated SiC Planar MOSFET also performs sub-optimally at turn-on switching due to its higher input capacitance and shows more temperature sensitivity due to its lower threshold voltage. In the 3rd quadrant, the relatively larger reverse recovery charge of Silicon Superjunction MOSFET negatively impacts the turn-OFF transients compared with the SiC MOSFETs. It is also seen that among the SiC
MOSFETs, the two double-trench MOSFET structures outperform the selected SiC planar MOSFET in terms of reverse recovery.
Original languageEnglish
Pages (from-to)265-276
Number of pages12
JournalIEEE Open Journal of Power Electronics
Volume2
Early online date12 Apr 2021
DOIs
Publication statusPublished - 3 May 2021

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