Anomalous scaling of the surface roughness during Cu electrodeposition

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

Abstract

For Cu electrodeposition from additive-free acid sulphate electrolyte, the local roughness does not always remain constant as required by the standard Family-Vicsek scaling ansatz. Instead, an additional scaling exponent is required to characterize the time evolution of the local roughness. The surface width w(l,t) scales as t(betaloc) l(H) when the deposition time t is large or the size I of the region over which w is measured is small, and as t(beta+betaloc) when l is large, or t small. When electrochemical parameters are varied, only beta(loc) changes, while the other power law exponents H and beta remain constant.
Translated title of the contributionAnomalous scaling of the surface roughness during Cu electrodeposition
Original languageEnglish
Title of host publicationInternational Symposium on Electrochemical Science and Technology of Copper, October 2000, Phoenix, Arizona
EditorsVanysek , P; Alodan, M; Lipowski, OM J; Mangussen
PublisherElectrochem. Soc. Inc
Pages42 - 48
Number of pages7
ISBN (Print)1566772974
Publication statusPublished - 2002

Bibliographical note

Conference Proceedings/Title of Journal: Electrochemical Science and Technology of Copper Proceedings 2002; Electrochemical Soc. Series 2000 (30)
Conference Organiser: Electrochem. Soc

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