Bispectral analysis of ultrasonic inter-modulation data for improved defect detection

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

2 Citations (Scopus)

Abstract

This paper describes the use of the ultrasonic inter-modulation technique for damage detection, which can offer potentially far greater sensitivity than linear acoustical methods. The specimen is excited by two continuous sinusoidal ultrasonic signals at different frequencies and the resultant vibration signal is captured for interrogation. A sensitive signal processing technique, known as bispectral analysis, is utilised which has the property of suppressing signal noise, permitting the detection of small nonlinear effects in the received vibration signal. This approach is demonstrated experimentally on samples containing fatigue cracking. A model is also presented which highlights the benefits of the bispectrum approach and potentially allows for characterisation of the nonlinearity.
Translated title of the contributionBispectral analysis of ultrasonic inter-modulation data for improved defect detection
Original languageEnglish
Title of host publication32nd Annual Review of Progress in Quantitative Nondestructive Evaluation, Maine
PublisherAmerican Institute of Physics (AIP)
Pages89 - 96
Volume820
ISBN (Print)0735403120
DOIs
Publication statusPublished - 2005

Bibliographical note

Conference Proceedings/Title of Journal: AIP Conference proceedings Vols 25A and 25B
Conference Organiser: Center for Nondestructive Evaluation at Iowa State University

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