@article{077fc9c884af4458a688b313d9bbc52e,
title = "BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems",
author = "Chao Wang and Jun Zhou and Roshan Weerasekera and Bin Zhao and Xin Liu and Philippe Royannez and Minkyu Je",
year = "2015",
doi = "10.1109/TCSI.2014.2354752",
language = "Undefined/Unknown",
volume = "62",
pages = "139--148",
journal = "IEEE Transactions on Circuits and Systems I: Regular Papers",
issn = "1549-8328",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
number = "1",
}