Characteristic resonance features of SOI-CMOS-compatible silicon nanoelectromechanical doubly-clamped beams up to 330 MHz

Yoshishige Tsuchiya*, Yilin Feng, Christos Giotis, Naoaki Harada, Mitsuhiro Shikida, Cecilia Dupre, Eric Ollier, Faezeh Arab Hassani, Hiroshi Mizuta

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)


This paper reports novel characteristic features of thermally-passivated Si nanoelectromechanical (NEM) beams fabricated via SOI-CMOS compatible processes with top-down hybrid EB/DUV lithography. Considerable difference of the resonance frequencies between the measurement results of the NEM beams with various lengths and the finite element simulation results suggests that effects of the undercut of the beam supports are serious for sub-micron beams. The resonance frequency of 332.57 MHz observed for an 800-nm-long beam is, to our knowledge, the highest ever as the fundamental resonance mode of lithographically-defined Si NEM beams. Clear change of the temperature dependence of the resonance frequencies with the varied beam lengths, observed for the first time, can be explained by considering effects of thermally-induced strain on the longer beams at higher temperatures.

Original languageEnglish
Title of host publication2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
Place of PublicationBelfast, UK
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages4
ISBN (Electronic)9781538647820
Publication statusPublished - 24 Apr 2018
Event31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018 - Belfast, United Kingdom
Duration: 21 Jan 201825 Jan 2018

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999


Conference31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
CountryUnited Kingdom

Bibliographical note

Funding Information:
This work has been partly supported by EU FP7 project NEMSIC (224525), TOBITATE! Young Ambassador Program, MEXT, Japan, and University of Southampton Summer Internship Program.

Publisher Copyright:
© 2018 IEEE.

Copyright 2018 Elsevier B.V., All rights reserved.

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