Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly

Zeina Abdallah, James W Pomeroy, Nicolas Blasakis, Athanasios Baltopoulos, Antonios Vavouliotis, Martin Kuball

Research output: Contribution to conferenceConference Paperpeer-review

Abstract

Thermal interface materials (TIM) are one of the key factors for an effective thermal management in packaged high-power electronic devices, hence the rapid growth of the TIM market. Novel TIMs based on nanoparticles are being developed to further ensure good heat conduction across interfaces in packages while ensuring a strong structural bond. Selecting the right thermal characterization technique for manufacturing feedback is challenging due to the lack of a widely accepted test method. In this work, low-frequency frequency domain thermoreflectance has been used to support material development and the process control of these novel nanoparticle-based TIMs.
Original languageEnglish
Number of pages3
Publication statusPublished - 2023
Event2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States - Orlando, United States
Duration: 15 May 202318 May 2023
https://csmantech.org/

Conference

Conference2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States
Abbreviated titleCS MANTECH 2023
Country/TerritoryUnited States
CityOrlando
Period15/05/2318/05/23
Internet address

Bibliographical note

This project has received funding from the European Union’s HORIZON 2020, Space Research Program, Technologies for European non-dependence and competitiveness, under grand agreement No. 821963, Project officers Mr. Andrej ROZKOV and Mr. Fabio VITOBELLO. The author would like to thank the collaborator in HORIZON 2020 HEATPACK project, Adamant Composites Ltd. for providing all the samples used in the demonstration.

Structured keywords

  • CDTR

Keywords

  • thermal interface material
  • frequency domain thermoreflectance
  • thermal conductivity
  • thermal characterization
  • transient method
  • material development
  • package assembly
  • interface resistance

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