Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly

Zeina Abdallah; James W Pomeroy; Nicolas  Blasakis; Athanasios Baltopoulos; Antonios Vavouliotis; Martin Kuball

Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly

Zeina Abdallah
, James W Pomeroy
, Nicolas Blasakis
, Athanasios Baltopoulos
, Antonios Vavouliotis
, Martin Kuball

School of Physics

Research output: Contribution to conference › Conference Paper › peer-review

Abstract

Thermal interface materials (TIM) are one of the key factors for an effective thermal management in packaged high-power electronic devices, hence the rapid growth of the TIM market. Novel TIMs based on nanoparticles are being developed to further ensure good heat conduction across interfaces in packages while ensuring a strong structural bond. Selecting the right thermal characterization technique for manufacturing feedback is challenging due to the lack of a widely accepted test method. In this work, low-frequency frequency domain thermoreflectance has been used to support material development and the process control of these novel nanoparticle-based TIMs.

Original language	English
Number of pages	3
Publication status	Published - 2023
Event	2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States - Orlando, United States Duration: 15 May 2023 → 18 May 2023 https://csmantech.org/

Conference

Conference	2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States
Abbreviated title	CS MANTECH 2023
Country/Territory	United States
City	Orlando
Period	15/05/23 → 18/05/23
Internet address	https://csmantech.org/

Bibliographical note

This project has received funding from the European Union’s HORIZON 2020, Space Research Program, Technologies for European non-dependence and competitiveness, under grand agreement No. 821963, Project officers Mr. Andrej ROZKOV and Mr. Fabio VITOBELLO. The author would like to thank the collaborator in HORIZON 2020 HEATPACK project, Adamant Composites Ltd. for providing all the samples used in the demonstration.

Research Groups and Themes

CDTR

Keywords

thermal interface material
frequency domain thermoreflectance
thermal conductivity
thermal characterization
transient method
material development
package assembly
interface resistance

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Abdallah, Z., Pomeroy, J. W., Blasakis, N., Baltopoulos, A., Vavouliotis, A., & Kuball, M. (2023). Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly. Paper presented at 2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States, Orlando, Florida, United States. https://csmantech.org/wp-content/uploads/2023/06/12.3.2023-CS_MANTECH_2023_final_Zeina_Abdallah.pdf

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title = "Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly",

abstract = "Thermal interface materials (TIM) are one of the key factors for an effective thermal management in packaged high-power electronic devices, hence the rapid growth of the TIM market. Novel TIMs based on nanoparticles are being developed to further ensure good heat conduction across interfaces in packages while ensuring a strong structural bond. Selecting the right thermal characterization technique for manufacturing feedback is challenging due to the lack of a widely accepted test method. In this work, low-frequency frequency domain thermoreflectance has been used to support material development and the process control of these novel nanoparticle-based TIMs.",

keywords = "thermal interface material, frequency domain thermoreflectance, thermal conductivity, thermal characterization, transient method, material development, package assembly, interface resistance",

author = "Zeina Abdallah and Pomeroy, \{James W\} and Nicolas Blasakis and Athanasios Baltopoulos and Antonios Vavouliotis and Martin Kuball",

note = "This project has received funding from the European Union{\textquoteright}s HORIZON 2020, Space Research Program, Technologies for European non-dependence and competitiveness, under grand agreement No. 821963, Project officers Mr. Andrej ROZKOV and Mr. Fabio VITOBELLO. The author would like to thank the collaborator in HORIZON 2020 HEATPACK project, Adamant Composites Ltd. for providing all the samples used in the demonstration.; 2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States, CS MANTECH 2023 ; Conference date: 15-05-2023 Through 18-05-2023",

year = "2023",

language = "English",

url = "https://csmantech.org/",

}

Abdallah, Z , Pomeroy, JW, Blasakis, N, Baltopoulos, A, Vavouliotis, A & Kuball, M 2023, 'Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly', Paper presented at 2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States, Orlando, United States, 15/05/23 - 18/05/23. <https://csmantech.org/wp-content/uploads/2023/06/12.3.2023-CS_MANTECH_2023_final_Zeina_Abdallah.pdf>

Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly. / Abdallah, Zeina ; Pomeroy, James W; Blasakis, Nicolas et al.
2023. Paper presented at 2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States, Orlando, Florida, United States.

Research output: Contribution to conference › Conference Paper › peer-review

TY - CONF

T1 - Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly

AU - Abdallah, Zeina

AU - Pomeroy, James W

AU - Blasakis, Nicolas

AU - Baltopoulos, Athanasios

AU - Vavouliotis, Antonios

AU - Kuball, Martin

N1 - This project has received funding from the European Union’s HORIZON 2020, Space Research Program, Technologies for European non-dependence and competitiveness, under grand agreement No. 821963, Project officers Mr. Andrej ROZKOV and Mr. Fabio VITOBELLO. The author would like to thank the collaborator in HORIZON 2020 HEATPACK project, Adamant Composites Ltd. for providing all the samples used in the demonstration.

PY - 2023

Y1 - 2023

N2 - Thermal interface materials (TIM) are one of the key factors for an effective thermal management in packaged high-power electronic devices, hence the rapid growth of the TIM market. Novel TIMs based on nanoparticles are being developed to further ensure good heat conduction across interfaces in packages while ensuring a strong structural bond. Selecting the right thermal characterization technique for manufacturing feedback is challenging due to the lack of a widely accepted test method. In this work, low-frequency frequency domain thermoreflectance has been used to support material development and the process control of these novel nanoparticle-based TIMs.

AB - Thermal interface materials (TIM) are one of the key factors for an effective thermal management in packaged high-power electronic devices, hence the rapid growth of the TIM market. Novel TIMs based on nanoparticles are being developed to further ensure good heat conduction across interfaces in packages while ensuring a strong structural bond. Selecting the right thermal characterization technique for manufacturing feedback is challenging due to the lack of a widely accepted test method. In this work, low-frequency frequency domain thermoreflectance has been used to support material development and the process control of these novel nanoparticle-based TIMs.

KW - thermal interface material

KW - frequency domain thermoreflectance

KW - thermal conductivity

KW - thermal characterization

KW - transient method

KW - material development

KW - package assembly

KW - interface resistance

M3 - Conference Paper

T2 - 2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States

Y2 - 15 May 2023 through 18 May 2023

ER -

Abdallah Z , Pomeroy JW, Blasakis N, Baltopoulos A, Vavouliotis A, Kuball M. Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly. 2023. Paper presented at 2023 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2023 - Orlando, FL, United States, Orlando, Florida, United States.

Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly

Abstract

Conference

Bibliographical note

Research Groups and Themes

Keywords

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