TY - JOUR
T1 - Chip-to-chip quantum teleportation and multi-photon entanglement in silicon
AU - Llewellyn, Daniel
AU - Ding, Yunhong
AU - Faruque, Imad I
AU - Paesani, Stefano
AU - Bacco, Davide
AU - Santagati, Raffaele
AU - Qian, Yan-Jun
AU - Li, Yan
AU - Xiao, Yun-Feng
AU - Huber, Marcus
AU - Malik, Mehul
AU - Sinclair, Gary F
AU - Zhou, Xiaoqi
AU - Rottwitt, Karsten
AU - O'Brien, Jeremy L
AU - Rarity, John
AU - Gong, Qihuang
AU - Oxenlowe, Leif K.
AU - Wang, Jianwei
AU - Thompson, Mark G
PY - 2019/12/23
Y1 - 2019/12/23
N2 - Integrated optics provides a versatile platform for quantum information processing and transceiving with photons [1,2,3,4,5,6,7,8]. The implementation of quantum protocols requires the capability to generate multiple high-quality single photons and process photons with multiple high-fidelity operators [9,10,11]. However, previous experimental demonstrations were faced by major challenges in realizing sufficiently high-quality multi-photon sources and multi-qubit operators in a single integrated system [4,5,6,7,8], and fully chip-based implementations of multi-qubit quantum tasks remain a significant challenge [1,2,3]. Here, we report the demonstration of chip-to-chip quantum teleportation and genuine multipartite entanglement, the core functionalities in quantum technologies, on silicon-photonic circuitry. Four single photons with high purity and indistinguishablity are produced in an array of microresonator sources, without requiring any spectral filtering. Up to four qubits are processed in a reprogrammable linear-optic quantum circuit that facilitates Bell projection and fusion operation. The generation, processing, transceiving and measurement of multi-photon multi-qubit states are all achieved in micrometre-scale silicon chips, fabricated by the complementary metal–oxide–semiconductor process. Our work lays the groundwork for large-scale integrated photonic quantum technologies for communications and computations.
AB - Integrated optics provides a versatile platform for quantum information processing and transceiving with photons [1,2,3,4,5,6,7,8]. The implementation of quantum protocols requires the capability to generate multiple high-quality single photons and process photons with multiple high-fidelity operators [9,10,11]. However, previous experimental demonstrations were faced by major challenges in realizing sufficiently high-quality multi-photon sources and multi-qubit operators in a single integrated system [4,5,6,7,8], and fully chip-based implementations of multi-qubit quantum tasks remain a significant challenge [1,2,3]. Here, we report the demonstration of chip-to-chip quantum teleportation and genuine multipartite entanglement, the core functionalities in quantum technologies, on silicon-photonic circuitry. Four single photons with high purity and indistinguishablity are produced in an array of microresonator sources, without requiring any spectral filtering. Up to four qubits are processed in a reprogrammable linear-optic quantum circuit that facilitates Bell projection and fusion operation. The generation, processing, transceiving and measurement of multi-photon multi-qubit states are all achieved in micrometre-scale silicon chips, fabricated by the complementary metal–oxide–semiconductor process. Our work lays the groundwork for large-scale integrated photonic quantum technologies for communications and computations.
KW - nonlinear optics
KW - quantum information
KW - quantum optics
U2 - 10.1038/s41567-019-0727-x
DO - 10.1038/s41567-019-0727-x
M3 - Article (Academic Journal)
SN - 1745-2473
VL - 16
SP - 148
EP - 153
JO - Nature Physics
JF - Nature Physics
ER -