Translated title of the contribution | Co-Ni-Cu/Cu multilayers electrodeposited using a channel flow cell |
---|---|
Original language | English |
Pages (from-to) | 218 - 222 |
Journal | J. Electrochem. Soc |
Volume | 149 |
Publication status | Published - 2002 |
Bibliographical note
Publisher: Electrochemical SocietyOther: Page numbers prefixed by "C"