Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes

AI Masliy, SN Ovchinnikova, AA Weiss, PA Laskarzhevskiy, VV Boldyrev, W Schwarzacher

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

Translated title of the contributionCurrent efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes
Original languageEnglish
Title of host publicationProc. of Symposium on Fundamentals of Electrochemical Deposition and Dissolution
PublisherElectrochemical Society
Pages375 - 380
Volume99
Publication statusPublished - 1999

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