Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes

AI Masliy; SN Ovchinnikova; AA Weiss; PA Laskarzhevskiy; VV Boldyrev; W Schwarzacher

Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes

AI Masliy
, SN Ovchinnikova
, AA Weiss
, PA Laskarzhevskiy
, VV Boldyrev
, W Schwarzacher

School of Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

Translated title of the contribution	Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes
Original language	English
Title of host publication	Proc. of Symposium on Fundamentals of Electrochemical Deposition and Dissolution
Publisher	Electrochemical Society
Pages	375 - 380
Volume	99
Publication status	Published - 1999

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Masliy, AI., Ovchinnikova, SN., Weiss, AA., Laskarzhevskiy, PA., Boldyrev, VV., & Schwarzacher, W. (1999). Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes. In Proc. of Symposium on Fundamentals of Electrochemical Deposition and Dissolution (Vol. 99, pp. 375 - 380). Electrochemical Society.

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title = "Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes",

author = "AI Masliy and SN Ovchinnikova and AA Weiss and PA Laskarzhevskiy and VV Boldyrev and W Schwarzacher",

year = "1999",

language = "English",

volume = "99",

pages = "375 -- 380",

booktitle = "Proc. of Symposium on Fundamentals of Electrochemical Deposition and Dissolution",

publisher = "Electrochemical Society",

}

Masliy, AI, Ovchinnikova, SN, Weiss, AA, Laskarzhevskiy, PA, Boldyrev, VV & Schwarzacher, W 1999, Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes. in Proc. of Symposium on Fundamentals of Electrochemical Deposition and Dissolution. vol. 99, Electrochemical Society, pp. 375 - 380.

Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes. / Masliy, AI; Ovchinnikova, SN; Weiss, AA et al.
Proc. of Symposium on Fundamentals of Electrochemical Deposition and Dissolution. Vol. 99 Electrochemical Society, 1999. p. 375 - 380.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes

AU - Masliy, AI

AU - Ovchinnikova, SN

AU - Weiss, AA

AU - Laskarzhevskiy, PA

AU - Boldyrev, VV

AU - Schwarzacher, W

PY - 1999

Y1 - 1999

M3 - Conference Contribution (Conference Proceeding)

VL - 99

SP - 375

EP - 380

BT - Proc. of Symposium on Fundamentals of Electrochemical Deposition and Dissolution

PB - Electrochemical Society

ER -

Masliy AI, Ovchinnikova SN, Weiss AA, Laskarzhevskiy PA, Boldyrev VV, Schwarzacher W. Current efficiency and the electromigration contribution to the Cu partial current during the deposition of Co-Ni-Cu alloys from acetate and sulphamate multilayer electrolytes. In Proc. of Symposium on Fundamentals of Electrochemical Deposition and Dissolution. Vol. 99. Electrochemical Society. 1999. p. 375 - 380