Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

8 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International
Pages	1-6
Number of pages	6
DOIs	https://doi.org/10.1109/3DIC.2012.6263047
Publication status	Published - 2012

Research Groups and Themes

@inproceedings{5d0dc315d7024f4e9f15f178a8c2bda8,

title = "Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar",

author = "Yuhao Wang and Chun Zhang and Revanth Nadipalli and Hao Yu and Roshan Weerasekera",

year = "2012",

doi = "10.1109/3DIC.2012.6263047",

language = "Undefined/Unknown",

pages = "1--6",

booktitle = "2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International",

}

TY - GEN

T1 - Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar

AU - Wang, Yuhao

AU - Zhang, Chun

AU - Nadipalli, Revanth

AU - Yu, Hao

AU - Weerasekera, Roshan

PY - 2012

Y1 - 2012

U2 - 10.1109/3DIC.2012.6263047

DO - 10.1109/3DIC.2012.6263047

M3 - Conference Contribution (Conference Proceeding)

SP - 1

EP - 6

BT - 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International

ER -