Developing cure kinetics models for interleaf particle toughened epoxies

James Kratz, Tassos Mesogitis, Alex Skordos, Ian Hamerton, Ivana K Partridge

Research output: Contribution to conferenceConference Paper

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In this study, we investigated the cure kinetics behaviour of the commercial Hexply® M21 thermoplastic interleaf epoxy resin system. Dynamic, isothermal, and cure interrupted modulated differential scanning calorimetry (mDSC) tests were used to measure the heat flow of the system, and semi-empirical models were fitted to the data. The cure kinetics model describes the cure rate satisfactorily, under both dynamic heating and isothermal conditions. The glass transition temperature was described using the DiBenedetto equation and showed that heating rate can influence formation of the network; therefore cure schedule must be controlled carefully during processing.
Original languageEnglish
Number of pages14
Publication statusPublished - 26 May 2016
EventSAMPE Long Beach 2016 - Long Beach Convention Center, Long Beach, CA, United States
Duration: 23 May 201623 May 2016


ConferenceSAMPE Long Beach 2016
Country/TerritoryUnited States
CityLong Beach, CA


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