Development of Residual Stresses During Laser Cladding

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Laser cladding rail steel with a hard-wearing martensitic stainless-steel coating is a possible technique for improving the track durability of rail networks. However, the cladding process induces significant residual stresses in the clad material, due to the thermal mismatch between the two materials and the shape changes during the martensitic phase transformation. Predictions of the residual stress remain poorly verified as the process is complex and measurements made on final clad parts can be influenced by multiple parameters.

A cladded and heat-treated rail section was subject to sequential laser-pulses representative of the actual cladding process. The thermal cycle of these pulses is much simpler than real clads, easing the task of validating the component parts of simulations. Synchrotron X-ray diffraction was used to determine the phase selective residual stresses around the heated region before and after each pulse. In this manner it was possible to determine the change in stress due to a pulse and the degree of relaxation that is possible due to a neighbouring thermal cycle.
Original languageEnglish
Title of host publicationResidual Stresses 2018 – ECRS-10
Subtitle of host publicationProceedings of the European Conference on Residual Stresses
EditorsMarc Seefeldt
PublisherMaterials Research Forum LLC
Number of pages6
ISBN (Electronic)9781945291890
ISBN (Print)9781945291883
Publication statusPublished - 18 Sep 2018

Publication series

NameMaterials Research Proceedings
PublisherMaterials Research Forum LLC
ISSN (Print)2474-3941
ISSN (Electronic)2474-395X



  • Cladding
  • Synchrotron X-Ray Diffraction
  • Stress-Measurement
  • Rail

Cite this

Narayanan, A., Mostafavi, M., Pavier, M., & Peel, M. (2018). Development of Residual Stresses During Laser Cladding. In M. Seefeldt (Ed.), Residual Stresses 2018 – ECRS-10: Proceedings of the European Conference on Residual Stresses (pp. 45-50). (Materials Research Proceedings; Vol. 6). Materials Research Forum LLC.