Dielectric cure monitoring of a fast curing resin system

Ffion A. Martin, Anastasia F. Koutsomitopoulou, Ivana K. Partridge, Alex A. Skordos

Research output: Contribution to conferenceConference Paperpeer-review

4 Citations (Scopus)

Abstract

Very short manufacture cycle times are required if continuous carbon fibre and epoxy composite components are to be economically viable material choices for high production volumes in the automotive industry. Manufacturing process variants of resin transfer moulding (RTM) target a reduction of in-mould manufacture time by reducing the time to infuse and cure components using fast curing resin systems with time to cure completion of about 5 minutes at processing temperature. The present study involves a new three part epoxy system supplied by Hexion designed for use with short cycle time RTM processes. Following the establishment of a cure kinetics model for this resin, the potential of dielectric cure monitoring for characterising the flow and cure of the resin in the mould was investigated and is reported here.

Original languageEnglish
Publication statusPublished - 1 Jan 2015
Event20th International Conference on Composite Materials, ICCM 2015 - Copenhagen, Denmark
Duration: 19 Jul 201524 Jul 2015

Conference

Conference20th International Conference on Composite Materials, ICCM 2015
CountryDenmark
CityCopenhagen
Period19/07/1524/07/15

Keywords

  • Cure Monitoring
  • Dielectric Sensor
  • Epoxy
  • Fast Cure

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