Dielectric Thickness and Fin Width Dependent OFF-State Degradation in AlGaN/GaN SLCFETs

Akhil S. Kumar*, Michael J Uren, Matthew D Smith, Martin Kuball, Justin Parke, H George Henry, Robert S. Howell

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

2 Citations (Scopus)
87 Downloads (Pure)

Abstract

Accelerated OFF-State stressing of multichannel AlGaN/GaN Superlattice Castellated Field Effect Transistors (SLCFET) with varying dielectric thickness (di) and fin-width (Wfin) was studied using noise measurements. As di increased, the failure mechanism changed from an abrupt breakdown to gradual time dependent dielectric breakdown (TDDB). Smaller Wfin is found to extend lifetime compared to wider Wfin under such stressing condition. Percolation theory and associated trap generation during stressing can explain the observed behavior.
Original languageEnglish
Title of host publication2023 IEEE International Reliability Physics Symposium (IRPS)
EditorsChris Connor
Place of PublicationIEEE Explore
Number of pages4
ISBN (Electronic)9781665456722
DOIs
Publication statusPublished - 15 May 2023
Event2023 IEEE International Reliability Physics Symposium (IRPS) - Hotel Hyatt Regency Monterey , Monterey, California, United States
Duration: 26 Mar 202330 Mar 2023
https://www.irps.org/

Publication series

Name
ISSN (Print)1541-7026
ISSN (Electronic)1938-1891

Conference

Conference2023 IEEE International Reliability Physics Symposium (IRPS)
Country/TerritoryUnited States
CityMonterey, California
Period26/03/2330/03/23
Internet address

Research Groups and Themes

  • CDTR

Keywords

  • gallium nitride
  • SLCFET
  • TDDB
  • lifetime
  • reliability
  • degradation
  • step-stressing
  • noise-analysis
  • 3D-TCAD
  • percolation theory
  • traps

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