Abstract
One of the factors limiting the more widespread use of adhesive bonding by industry is the lack of fast and reliable non-destructive testing methods. This paper describes a novel low frequency (<500kHz) dry coupled wheel probe which can be used to assess the integrity of three layered adhesive joints. A key novel element of this wheel probe is its operation in pulse-echo mode at low frequencies with a wide bandwidth. The system measures the first through thickness resonance of the joint which is then used to infer bondline thickness. The system is demonstrated on a range of adhesively bonded specimens of automotive specification. Also its sensitivity to alignment and coupling are discussed as are other factors limiting its operation.
Original language | English |
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Pages (from-to) | 27-36 |
Number of pages | 10 |
Journal | NDT and E International |
Volume | 36 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1 Jan 2003 |
Keywords
- Adhesive bonding
- Dry-coupling
- Ultrasound
- Wheel probe