Abstract
We report that dynamic Ron can increase with off-state stress time, only saturating after >300s. We show that a wide range of dynamic Ron behaviors is observed in small devices whereas large devices show behavior characteristic of an average over the small devices. This behavior can be explained by preferential vertical leakage paths separated by tens of microns. Long time constant dispersion is observed in some wafers but this is suppressed in later generation epitaxy.
Original language | English |
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Title of host publication | CS MANTECH 2016 |
Subtitle of host publication | International Conference on Compound Semiconductor Manufacturing Technology |
Publisher | CS Mantech |
Pages | 211-214 |
Number of pages | 4 |
Publication status | Published - 17 May 2016 |
Event | 31st Annual International Conference on Compound Semiconductor Manufacturing Technology, CS ManTech 2016 - Miami, United States Duration: 16 May 2016 → 19 May 2016 |
Conference
Conference | 31st Annual International Conference on Compound Semiconductor Manufacturing Technology, CS ManTech 2016 |
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Country/Territory | United States |
City | Miami |
Period | 16/05/16 → 19/05/16 |
Research Groups and Themes
- CDTR
Keywords
- HEMT
- GaN
- AlGaN
- Power devices
- Dynamic ON-resistance
- device size