Dynamic scaling of the surface roughness of Cu deposited using a chemical bath

NM Hasan, JJ Mallett, SG dos Santos Filhos, AA Pasa, W Schwarzacher

Research output: Contribution to journalArticle (Academic Journal)peer-review

31 Citations (Scopus)

Abstract

In electroless deposition, a chemical reducing agent is used to deposit a metal film from a solution of its ions. Electroless Cu films deposited with HCHO as the reducing agent exhibit anomalous scaling, with the root-mean-square interface width w varying as t(beta loc) at short length scales. Changing the HCHO concentration changes the growth rate, but not the scaling exponents other than beta(loc). The nonchanging exponents were measured as H=0.74+/-0.03 and beta=0.28+/-0.03, where H is the Hurst exponent, and w varies as t(beta+beta loc) at long length scales. Our results reveal similarities with the dynamic scaling of conventional electrodeposited films.
Translated title of the contributionDynamic scaling of the surface roughness of Cu deposited using a chemical bath
Original languageEnglish
Pages (from-to)1 - 4
Number of pages4
JournalPhysical Review B: Condensed Matter and Materials Physics
Volume67 (8, 081401)
DOIs
Publication statusPublished - Feb 2003

Bibliographical note

Publisher: American Physical Society

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