Abstract
In electroless deposition, a chemical reducing agent is used to deposit a metal film from a solution of its ions. Electroless Cu films deposited with HCHO as the reducing agent exhibit anomalous scaling, with the root-mean-square interface width w varying as t(beta loc) at short length scales. Changing the HCHO concentration changes the growth rate, but not the scaling exponents other than beta(loc). The nonchanging exponents were measured as H=0.74+/-0.03 and beta=0.28+/-0.03, where H is the Hurst exponent, and w varies as t(beta+beta loc) at long length scales. Our results reveal similarities with the dynamic scaling of conventional electrodeposited films.
Translated title of the contribution | Dynamic scaling of the surface roughness of Cu deposited using a chemical bath |
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Original language | English |
Pages (from-to) | 1 - 4 |
Number of pages | 4 |
Journal | Physical Review B: Condensed Matter and Materials Physics |
Volume | 67 (8, 081401) |
DOIs | |
Publication status | Published - Feb 2003 |