Electrical transmission characteristics of vertical transition with through silicon vias (TSVs) in 3D die stack

Ka Fai Chang, Roshan Weerasekera, Suryanarayana Shivakumar Bhattacharya

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

Original language	Undefined/Unknown
Title of host publication	2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)
Pages	1-4
Number of pages	4
DOIs	https://doi.org/10.1109/EPTC.2015.7412339
Publication status	Published - 2015

Research Groups and Themes

@inproceedings{a760ed50366544d78a5fb36e5d4ffe41,

title = "Electrical transmission characteristics of vertical transition with through silicon vias (TSVs) in 3D die stack",

author = "Chang, \{Ka Fai\} and Roshan Weerasekera and Bhattacharya, \{Suryanarayana Shivakumar\}",

year = "2015",

doi = "10.1109/EPTC.2015.7412339",

language = "Undefined/Unknown",

pages = "1--4",

booktitle = "2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)",

}

Electrical transmission characteristics of vertical transition with through silicon vias (TSVs) in 3D die stack. / Chang, Ka Fai; Weerasekera, Roshan; Bhattacharya, Suryanarayana Shivakumar.
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). 2015. p. 1-4.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - Electrical transmission characteristics of vertical transition with through silicon vias (TSVs) in 3D die stack

AU - Chang, Ka Fai

AU - Weerasekera, Roshan

AU - Bhattacharya, Suryanarayana Shivakumar

PY - 2015

Y1 - 2015

U2 - 10.1109/EPTC.2015.7412339

DO - 10.1109/EPTC.2015.7412339

M3 - Conference Contribution (Conference Proceeding)

SP - 1

EP - 4

BT - 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

ER -