Abstract
Reconfigurable smart structures and robots require interconnects that enable the transfer of forces, power and data from one modular element to another. This is typically achieved through magnetic coupling, mechanical clips and male–female electrical contacts. In lightweight structures however, these methods are impractical due to weight and complexity. In this work we present an electroadhesive coupling (EAC) controllable interfacial connection for joining lightweight modular components, which enable simultaneous mechanical joining and electrical pass-through connections for power and communication. Active adhesion and power transfer are realized by electroadhesion (EA) using conducting electrodes on lightweight materials such as papers. We present the underlying EAC concept, materials and structures, and demonstrate this new approach using origami and kirigami structures to fabricate a modular EAC bridge and a modular EAC cuboid structural interconnection system. These novel structures have the potential for application in lightweight robotics, space systems, deployable and self-assembling and self-disassembling systems.
Original language | English |
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Number of pages | 8 |
Journal | Smart Materials and Structures |
Volume | 28 |
DOIs | |
Publication status | Published - 29 Aug 2019 |
Research Groups and Themes
- Tactile Action Perception
Keywords
- active connection
- active power transfer
- electroadhesion
- electroadhesive interconnect