Electrothermal power cycling of 15 kV SiC PiN diodes

Chengjun Shen, Saeed Jahdi*, Sai Priya Munagala, Nick Simpson, Phil Mellor, Olayiwola Alatise, Jose Ortiz Gonzalez

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)peer-review

1 Citation (Scopus)
44 Downloads (Pure)

Abstract

Through extensive experimental measurements for the static and dynamic characteristics, the commercially available 15 kV Silicon Carbide (SiC) PiN diode are evaluated by power cycling. The forward voltage of diodes is used to indirectly measure the junction temperature. The SiC PiN diodes feature smaller die size, less reverse recovery charge and less on-resistance when compared to the commercially available closely rated Silicon PiN diodes. Nevertheless, during the power cycling experiments, the bipolar degradation and the degradation of contact metallization in SiC PiN diode gives rise to the increase of on-resistance even though its on-state losses is not as high as in the Silicon device. Such degradations are not observed from the Silicon PiN diode for the same junction temperature and the same high-temperature duration.
Original languageEnglish
Article number115310
Number of pages24
JournalMicroelectronics Reliability
Volume153
Early online date30 Dec 2023
DOIs
Publication statusPublished - 1 Feb 2024

Bibliographical note

Publisher Copyright:
© 2023 The Authors.

Keywords

  • SiC
  • Silicon Carbide
  • DIODE
  • PIN
  • Power cycling
  • electrothermal ruggedness

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