Embossing of ceramic micro-pillar arrays

B. Su*, D. Zhang, T. W. Button

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)

10 Citations (Scopus)

Abstract

A microfabrication method for producing ceramic micro-pillars is reported. The method is based on embossing of a gelforming ceramic substrate using a sacrificial polymer mould to produce ceramic micro-pillars with aspect ratios of up to 10. Such high aspect ratio ceramic micro-pillars have been demonstrated for the fabrication of 1-3 PZT piezocomposites. It is also suitable for producing any ceramic MEMS or micropatterned ceramics or microcomponents. The results indicate that the crosslinkable polymer binder system used in the gelforming processing is crucial to retain the structural integrity during mould removal and sintering stages, especially for the high aspect ratio ceramic micro-pillar structures. (c) 2012 Elsevier Ltd. All rights reserved.

Original languageEnglish
Pages (from-to)3345-3349
Number of pages5
JournalJournal of the European Ceramic Society
Volume32
Issue number12
DOIs
Publication statusPublished - Sep 2012

Keywords

  • Microstructure-final
  • FABRICATION
  • COMPOSITES
  • TRANSDUCERS
  • LIGA PROCESS
  • PZT
  • MICROFABRICATION
  • MICROSTRUCTURES
  • Shaping
  • Microstructure-prefiring
  • Functional applications
  • CONNECTIVITY
  • PIEZOELECTRICS

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