Examination of Delay and Signal Integrity Metrics in Through-Silicon Vias

Matt Grange, Roshan Weerasekera, Dinesh Pamunuwa, Hannu Tenhunen

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

Original languageUndefined/Unknown
Title of host publicationProc. Special Interest Workshop on 3D Integration -- Design Automation and Test in Europe (DATE)
Publication statusPublished - 1 Apr 2009

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