Experimental Evaluation of a Low-Cost QFN Silicon Carbide Half-Bridge Module

Martin Arnold, Ian Laird, Andy Longford, Xibo Yuan

Research output: Contribution to journal › Article (Academic Journal) › peer-review

Original language	English
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Early online date	21 Jun 2019
Publication status	E-pub ahead of print - 21 Jun 2019

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@article{dcbfa917e1b04e7a86a519c702acf3c6,

title = "Experimental Evaluation of a Low-Cost QFN Silicon Carbide Half-Bridge Module",

author = "Martin Arnold and Ian Laird and Andy Longford and Xibo Yuan",

year = "2019",

month = jun,

day = "21",

language = "English",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

}

TY - JOUR

T1 - Experimental Evaluation of a Low-Cost QFN Silicon Carbide Half-Bridge Module

AU - Arnold, Martin

AU - Laird, Ian

AU - Longford, Andy

AU - Yuan, Xibo

PY - 2019/6/21

Y1 - 2019/6/21

M3 - Article (Academic Journal)

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

ER -