Extending Systems-on-Chip to the Third Dimension: Performance, Cost and Technological Tradeoffs

Roshan Weerasekera, Li-Rong Zheng, Dinesh Pamunuwa, Hannu Tenhunen

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

87 Citations (Scopus)

Abstract

Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them.
Original languageUndefined/Unknown
Title of host publicationProc. IEEE/ACM International Conference on Computer-Aided Design
Pages212-219
Number of pages8
DOIs
Publication statusPublished - 1 Nov 2007

Keywords

  • semiconductor device manufacture
  • system-on-chip
  • 2D planar SoC single-chip solutions
  • cost trade-off analysis
  • design cycle time
  • electronic system design technology
  • high-density portable hand-held applications
  • single-level embedded modules
  • system conceptual level
  • systems-on-chip
  • tiled silicon
  • Circuit noise
  • Cost function
  • Dielectric substrates
  • Fabrication
  • Integrated circuit interconnections
  • Performance analysis
  • Power system interconnection
  • Radio frequency
  • Routing
  • Silicon

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