Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)

Guruprasad Katti; Li Hong Yu; Songbai Zhang; Rahul Dutta; Roshan Weerasekera; Ka Fai Chang; Jong-Kai Lin; Srinivasa Rao Vempati; Surya Bhattacharya

doi:10.1109/MDAT.2015.2424429

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)

Guruprasad Katti, Li Hong Yu, Songbai Zhang, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Srinivasa Rao Vempati, Surya Bhattacharya

Research output: Contribution to journal › Article (Academic Journal) › peer-review

10 Citations (Scopus)

Original language	Undefined/Unknown
Pages (from-to)	23-31
Number of pages	9
Journal	IEEE Design Test
Volume	32
Issue number	4
DOIs	https://doi.org/10.1109/MDAT.2015.2424429
Publication status	Published - 2015

Research Groups and Themes

Photonics and Quantum

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10.1109/MDAT.2015.2424429

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Cite this

@article{0b2c9ba72f604294b3a334fc8d16fe10,

title = "Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)",

author = "Guruprasad Katti and Yu, \{Li Hong\} and Songbai Zhang and Rahul Dutta and Roshan Weerasekera and Chang, \{Ka Fai\} and Jong-Kai Lin and Vempati, \{Srinivasa Rao\} and Surya Bhattacharya",

year = "2015",

doi = "10.1109/MDAT.2015.2424429",

language = "Undefined/Unknown",

volume = "32",

pages = "23--31",

journal = "IEEE Design Test",

issn = "2168-2364",

publisher = "IEEE Computer Society",

number = "4",

}

TY - JOUR

T1 - Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)

AU - Katti, Guruprasad

AU - Yu, Li Hong

AU - Zhang, Songbai

AU - Dutta, Rahul

AU - Weerasekera, Roshan

AU - Chang, Ka Fai

AU - Lin, Jong-Kai

AU - Vempati, Srinivasa Rao

AU - Bhattacharya, Surya

PY - 2015

Y1 - 2015

U2 - 10.1109/MDAT.2015.2424429

DO - 10.1109/MDAT.2015.2424429

M3 - Article (Academic Journal)

SN - 2168-2364

VL - 32

SP - 23

EP - 31

JO - IEEE Design Test

JF - IEEE Design Test

IS - 4

ER -