Hardware Platform for Edge Computing Based on Nanoelectromechanical Relays

Dinesh Pamunuwa*, Elliott Worsey, Qi Tang, Mukesh K. Kulsreshath, Victor Marot, Yingying Li, Simon Bleiker

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

4 Citations (Scopus)
5 Downloads (Pure)

Abstract

NEM relay-based circuits can operate in harsh environmental conditions, high temperatures and high levels of radiation, without consuming energy in standby mode. These attributes make NEM relay technology very attractive for edge computing applications in industrial and manufacturing sectors. Here we describe a complete hardware platform for designing and fabricating densely integrated NEM relay circuits, and discuss the design of several prototypes we are developing to showcase this technology.
Original languageEnglish
Title of host publication2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages537-541
Number of pages5
ISBN (Electronic)9784886864352
ISBN (Print)9798350333022
Publication statusPublished - 7 May 2024
Event22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023 - Kyoto, Japan
Duration: 25 Jun 202329 Jun 2023
https://transducers2023.org/

Publication series

NameInternational Conference on Solid State Sensors and Actuators (TRANSDUCERS)
PublisherIEEE
ISSN (Print)2167-0013
ISSN (Electronic)2167-0021

Conference

Conference22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
Country/TerritoryJapan
CityKyoto
Period25/06/2329/06/23
Internet address

Bibliographical note

Publisher Copyright:
© 2023 IEEJ.

Keywords

  • edge computing
  • high-temperature
  • Industry 4.0
  • IoT
  • low power
  • microelectromechanical
  • Nanoelectromechanical
  • radiation-hard

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