Heat transfer simulation of the cure of thermoplastic particle interleaf carbon fibre epoxy prepregs

Tassos Mesogitis*, James Kratz, Alex Skordos

*Corresponding author for this work

Research output: Contribution to journalArticle (Academic Journal)peer-review

18 Citations (Scopus)
682 Downloads (Pure)


Thermochemical properties are needed to develop process models and define suitable cure cycles to convert thermosetting polymers into rigid glassy materials. Uncertainty surrounding the suitability of thermal analysis techniques and semi-empirical models developed for conventional composite materials has been raised for the new class of particle interleaf materials. This paper describes kinetics, conductivity, heat capacity and glass transition temperature measurements of HexPly® M21 particle interleaf material. Thermal models describing conventional, non-particle epoxy systems were fit to the data and validated through a thick-section cure. Results from curing experiments agree with heat transfer simulation predictions, indicating that established thermal analysis techniques and models can describe polymerisation and evolving material properties during processing of a material representing the class of interleaf toughened systems. A sensitivity study showed time savings up to about 20%, and associated energy-efficiency-productivity benefits can be achieved by using cure simulation for particle interleaf materials.
Original languageEnglish
Pages (from-to)2053-2064
Number of pages12
JournalJournal of Composite Materials
Issue number15
Early online date13 Dec 2018
Publication statusPublished - 1 Jun 2019


  • Cure behaviour
  • Particle-reinforcement
  • Thermal analysis
  • Process modelling


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