Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications

Martin Kuball; James W Pomeroy

doi:10.1109/LTB-3D53950.2021.9598428

Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications

Martin Kuball, James W Pomeroy

School of Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

1 Citation (Scopus)

22 Downloads (Pure)

Abstract

Heterogenous integration of materials and devices opens huge opportunities for exploiting device structures which benefit from an optimal combination of electronic and thermal material properties. It is critically important to assess heat transfer across their interfaces to avoid thermal bottlenecks resulting in excessive device temperatures though. Experimental techniques to assess thermal conductivity of materials and thermal boundary resistance between materials are reviewed, with examples from GaN-on-Diamond, diamond to metal diamond composites.

Original language	English
Title of host publication	2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Number of pages	1
ISBN (Electronic)	9781665405676
ISBN (Print)	9781665405683
DOIs	https://doi.org/10.1109/LTB-3D53950.2021.9598428
Publication status	Published - 9 Nov 2021
Event	7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Online Duration: 5 Oct 2021 → 11 Oct 2021 Conference number: 21462758 https://imsi.jp/ltb3d/ltb3d-2021/

Conference

Conference	7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Abbreviated title	LTB-3D
Period	5/10/21 → 11/10/21
Internet address	https://imsi.jp/ltb3d/ltb3d-2021/

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10.1109/LTB-3D53950.2021.9598428Licence: Unspecified

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This is the accepted author manuscript (AAM). The final published version (version of record) is available online via IEEE at https://ieeexplore.ieee.org/document/9598428. Please refer to any applicable terms of use of the publisher.
Accepted author manuscript, 291 KBLicence: CC BY

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@inproceedings{1abe7c1a0538449a9b5cc79f643f7933,

title = "Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications",

abstract = "Heterogenous integration of materials and devices opens huge opportunities for exploiting device structures which benefit from an optimal combination of electronic and thermal material properties. It is critically important to assess heat transfer across their interfaces to avoid thermal bottlenecks resulting in excessive device temperatures though. Experimental techniques to assess thermal conductivity of materials and thermal boundary resistance between materials are reviewed, with examples from GaN-on-Diamond, diamond to metal diamond composites.",

author = "Martin Kuball and Pomeroy, {James W}",

year = "2021",

month = nov,

day = "9",

doi = "10.1109/LTB-3D53950.2021.9598428",

language = "English",

isbn = "9781665405683",

booktitle = "2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), LTB-3D ; Conference date: 05-10-2021 Through 11-10-2021",

url = "https://imsi.jp/ltb3d/ltb3d-2021/",

}

Kuball, M & Pomeroy, JW 2021, Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications. in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). Institute of Electrical and Electronics Engineers (IEEE), 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 5/10/21. https://doi.org/10.1109/LTB-3D53950.2021.9598428

Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications. / Kuball, Martin ; Pomeroy, James W.
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). Institute of Electrical and Electronics Engineers (IEEE), 2021.

Research output: Chapter in Book/Report/Conference proceeding › Conference Contribution (Conference Proceeding)

TY - GEN

T1 - Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications

AU - Kuball, Martin

AU - Pomeroy, James W

N1 - Conference code: 21462758

PY - 2021/11/9

Y1 - 2021/11/9

N2 - Heterogenous integration of materials and devices opens huge opportunities for exploiting device structures which benefit from an optimal combination of electronic and thermal material properties. It is critically important to assess heat transfer across their interfaces to avoid thermal bottlenecks resulting in excessive device temperatures though. Experimental techniques to assess thermal conductivity of materials and thermal boundary resistance between materials are reviewed, with examples from GaN-on-Diamond, diamond to metal diamond composites.

AB - Heterogenous integration of materials and devices opens huge opportunities for exploiting device structures which benefit from an optimal combination of electronic and thermal material properties. It is critically important to assess heat transfer across their interfaces to avoid thermal bottlenecks resulting in excessive device temperatures though. Experimental techniques to assess thermal conductivity of materials and thermal boundary resistance between materials are reviewed, with examples from GaN-on-Diamond, diamond to metal diamond composites.

U2 - 10.1109/LTB-3D53950.2021.9598428

DO - 10.1109/LTB-3D53950.2021.9598428

M3 - Conference Contribution (Conference Proceeding)

SN - 9781665405683

BT - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

PB - Institute of Electrical and Electronics Engineers (IEEE)

T2 - 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Y2 - 5 October 2021 through 11 October 2021

ER -

Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications

Abstract

Conference

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