Heat Transport across Interfaces for the Optimization of Heat Sinking in Device Applications

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

1 Citation (Scopus)
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Abstract

Heterogenous integration of materials and devices opens huge opportunities for exploiting device structures which benefit from an optimal combination of electronic and thermal material properties. It is critically important to assess heat transfer across their interfaces to avoid thermal bottlenecks resulting in excessive device temperatures though. Experimental techniques to assess thermal conductivity of materials and thermal boundary resistance between materials are reviewed, with examples from GaN-on-Diamond, diamond to metal diamond composites.
Original languageEnglish
Title of host publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages1
ISBN (Electronic)9781665405676
ISBN (Print)9781665405683
DOIs
Publication statusPublished - 9 Nov 2021
Event7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Online
Duration: 5 Oct 202111 Oct 2021
Conference number: 21462758
https://imsi.jp/ltb3d/ltb3d-2021/

Conference

Conference7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Abbreviated title LTB-3D
Period5/10/2111/10/21
Internet address

Structured keywords

  • CDTR

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