Heterogeneous 3-D Integration Approach for Nanoelectromechanical Switches

Yingying Li; Simon J. Bleiker; Elliott Worsey; Mukesh Kumar Kulsreshath; Qi Tang; Christian  Reich; Stefan Ernst Ernst; Shyamprasad N.  Raja; August  Djuphammar; Kristinn b. Gylfason; Dinesh  Pamunuwa; Frank Niklaus

Heterogeneous 3-D Integration Approach for Nanoelectromechanical Switches

Yingying Li, Simon J. Bleiker, Elliott Worsey, Mukesh Kumar Kulsreshath, Qi Tang, Christian Reich, Stefan Ernst Ernst, Shyamprasad N. Raja, August Djuphammar, Kristinn b. Gylfason, Dinesh Pamunuwa, Frank Niklaus

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Abstract

We present a three-dimensional (3-D) heterogeneous integration approach that enables seamless incorporation of nanoelectromechanical (NEM) devices within a standard CMOS process. The developed process flow supports the co-integration of multiple device types and functionalities, demonstrated here with both volatile 3-terminal (3-T) and non-volatile 7-terminal (7-T) NEM switches, which can be utilized to construct densely integrated NEM switch-based logic circuits and non-volatile memories. This approach establishes a scalable route toward compact, low-power hybrid systems that combine CMOS and NEM technologies in a single chip.

Original language	English
Publication status	Published - 4 Dec 2025
Event	Waferbond '25: Conference on wafer Bonding for Microsystems 3D- and Wafer Level integration - Chemnitz , Germany Duration: 3 Dec 2025 → 4 Dec 2025 https://www.waferbond.de/

Conference

Conference	Waferbond '25
Country/Territory	Germany
City	Chemnitz
Period	3/12/25 → 4/12/25
Internet address	https://www.waferbond.de/

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@conference{e17493b661414389973852728ae26a13,

title = "Heterogeneous 3-D Integration Approach for Nanoelectromechanical Switches",

abstract = "We present a three-dimensional (3-D) heterogeneous integration approach that enables seamless incorporation of nanoelectromechanical (NEM) devices within a standard CMOS process. The developed process flow supports the co-integration of multiple device types and functionalities, demonstrated here with both volatile 3-terminal (3-T) and non-volatile 7-terminal (7-T) NEM switches, which can be utilized to construct densely integrated NEM switch-based logic circuits and non-volatile memories. This approach establishes a scalable route toward compact, low-power hybrid systems that combine CMOS and NEM technologies in a single chip. ",

author = "Yingying Li and Bleiker, \{Simon J.\} and Elliott Worsey and Kulsreshath, \{Mukesh Kumar\} and Qi Tang and Christian Reich and Ernst, \{Stefan Ernst\} and Raja, \{Shyamprasad N.\} and August Djuphammar and Gylfason, \{Kristinn b.\} and Dinesh Pamunuwa and Frank Niklaus",

year = "2025",

month = dec,

day = "4",

language = "English",

note = "Waferbond '25 : Conference on wafer Bonding for Microsystems 3D- and Wafer Level integration ; Conference date: 03-12-2025 Through 04-12-2025",

url = "https://www.waferbond.de/",

}

TY - CONF

T1 - Heterogeneous 3-D Integration Approach for Nanoelectromechanical Switches

AU - Li, Yingying

AU - Bleiker, Simon J.

AU - Worsey, Elliott

AU - Kulsreshath, Mukesh Kumar

AU - Tang, Qi

AU - Reich, Christian

AU - Ernst, Stefan Ernst

AU - Raja, Shyamprasad N.

AU - Djuphammar, August

AU - Gylfason, Kristinn b.

AU - Pamunuwa, Dinesh

AU - Niklaus, Frank

PY - 2025/12/4

Y1 - 2025/12/4

N2 - We present a three-dimensional (3-D) heterogeneous integration approach that enables seamless incorporation of nanoelectromechanical (NEM) devices within a standard CMOS process. The developed process flow supports the co-integration of multiple device types and functionalities, demonstrated here with both volatile 3-terminal (3-T) and non-volatile 7-terminal (7-T) NEM switches, which can be utilized to construct densely integrated NEM switch-based logic circuits and non-volatile memories. This approach establishes a scalable route toward compact, low-power hybrid systems that combine CMOS and NEM technologies in a single chip.

AB - We present a three-dimensional (3-D) heterogeneous integration approach that enables seamless incorporation of nanoelectromechanical (NEM) devices within a standard CMOS process. The developed process flow supports the co-integration of multiple device types and functionalities, demonstrated here with both volatile 3-terminal (3-T) and non-volatile 7-terminal (7-T) NEM switches, which can be utilized to construct densely integrated NEM switch-based logic circuits and non-volatile memories. This approach establishes a scalable route toward compact, low-power hybrid systems that combine CMOS and NEM technologies in a single chip.

M3 - Conference Abstract

T2 - Waferbond '25

Y2 - 3 December 2025 through 4 December 2025

ER -

Heterogeneous 3-D Integration Approach for Nanoelectromechanical Switches

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