Imaging microstructure and stress fields within a cross-ply composite laminate

RJ Davies, SJ Eichhorn, JA Bennett, C Riekel, RJ Young

Research output: Contribution to journal › Article (Academic Journal) › peer-review

1 Citation (Scopus)

Original language	English
Pages (from-to)	567-574
Number of pages	8
Journal	Composites Science and Technology
Volume	69
DOIs	https://doi.org/10.1016/j.compscitech.2008.11.037
Publication status	Published - 1 Apr 2009

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title = "Imaging microstructure and stress fields within a cross-ply composite laminate",

author = "RJ Davies and SJ Eichhorn and JA Bennett and C Riekel and RJ Young",

year = "2009",

month = apr,

day = "1",

doi = "10.1016/j.compscitech.2008.11.037",

language = "English",

volume = "69",

pages = "567--574",

journal = "Composites Science and Technology",

issn = "0266-3538",

publisher = "Elsevier B.V.",

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TY - JOUR

T1 - Imaging microstructure and stress fields within a cross-ply composite laminate

AU - Davies, RJ

AU - Eichhorn, SJ

AU - Bennett, JA

AU - Riekel, C

AU - Young, RJ

PY - 2009/4/1

Y1 - 2009/4/1

U2 - 10.1016/j.compscitech.2008.11.037

DO - 10.1016/j.compscitech.2008.11.037

M3 - Article (Academic Journal)

SN - 0266-3538

VL - 69

SP - 567

EP - 574

JO - Composites Science and Technology

JF - Composites Science and Technology

ER -