In-situ stress measurements during UPD and OPD cyclic voltammetry of Pb on Cu in the presence and absence of Cl- ions

J Velleuer, G Wu, GC Allen, KR Hallam, KV Ragnarsdottir, W Schwarzacher

Research output: Chapter in Book/Report/Conference proceedingConference Contribution (Conference Proceeding)

Abstract

The preparation of thin films by electrochemical methods is common because of its easy availability and low costs compared to thin film preparation in UHV. It is of interest to study the fundamental characteristics and properties of such films during their preparation. It is possible to correlate the stress signal with the nucleation, coalescence and further growth of vapour-deposited films. Thus, measuring the stress during deposition is a powerful experimental tool. We describe a system which allows us to measure simultaneously both the current and intrinsic stress with submonolayer resolution during cyclic voltammetry and potentiostatic electrodeposition. We study the growth of Pb on Cu in the presence and absence of chloride.
Translated title of the contributionIn-situ stress measurements during UPD and OPD cyclic voltammetry of Pb on Cu in the presence and absence of Cl- ions
Original languageEnglish
Title of host publicationGordon Research Conference, New London, USA
Publication statusPublished - 2008

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